Methods and systems for adhering microfeature workpieces to support members

• US 20060189036A1
• Filed: 04/19/2006
• Published: 08/24/2006
• Est. Priority Date: 02/08/2005
• Status: Active Grant

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Fernandez, John C., Clyne, Craig T.
• Granted Patent: US 7,518,237 B2
• Time in Patent Office: Days
• US Class Current: 438/118
• CPC Class Codes: H01L 2224/06135 Covering only the peripheral area of the surface to be connected, i.e. peripheral arrangements
• CPC Class Codes: H01L 2224/06136 Covering only the central area of the surface to be connected, i.e. central arrangements
• CPC Class Codes: H01L 2224/29101 the principal constituent melting at a temperature of less than 400°C
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/4824 Connecting between the body and an opposite side of the item with respect to the body
• CPC Class Codes: H01L 2224/73215 Layer and wire connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83101 as prepeg comprising a layer connector, e.g. provided in an insulating plate member
• CPC Class Codes: H01L 2224/83193 wherein the layer connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83856 Pre-cured adhesive, i.e. B-stage adhesive
• CPC Class Codes: H01L 2224/92247 the second connecting process involving a wire connector
• CPC Class Codes: H01L 2225/06562 at least one device in the stack being rotated or offset
• CPC Class Codes: H01L 2225/06568 the devices decreasing in size, e.g. pyramidical stack
• CPC Class Codes: H01L 24/27 Manufacturing methods
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/1532 : the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3512 : Cracking
• CPC Class Codes: Y10T 156/10 : Methods of surface bonding and/or assembly therefor

Abstract

Methods and systems for adhering microfeature workpieces to support members are disclosed. A method in accordance with one embodiment of the invention includes disposing a first adhesive on a surface of a microfeature workpiece, and disposing a second adhesive on a surface of a support member. The method can further include adhesively attaching the microfeature workpiece to the support member by contacting the first adhesive with the second adhesive while the second adhesive is only partially cured. In further particular embodiments, the first and second adhesives can have different compositions, and the second adhesive can be fully cured after the microfeature workpiece and support member are adhesively attached.

Claims

1-36. -36. (canceled)

37. A microfeature workpiece system, comprising:

a microfeature workpiece having a first major surface, a second major surface facing away from the first major surface, and an edge surface between the first and second major surfaces;

a support member positioned adjacent to the microfeature workpiece; and

an adhesive assembly attached between the microfeature workpiece and the support member, the adhesive assembly including a first layer having a first composition and a first generally uniform thickness, the adhesive assembly further including a second layer having a second composition different than the first composition and having a second generally uniform thickness.

38. The system of claim 37 wherein the adhesive assembly is configured to fail at a location between a first interface and a second interface when the assembly is subjected to a stress, the first interface being at a junction between the adhesive assembly and the support member, the second interface being at a junction between the adhesive assembly and the microfeature workpiece.

39. The system of claim 37 wherein the microfeature workpiece has a first major surface, a second major surface facing opposite from the first major surface, and an edge surface between the first and second major surfaces, and wherein the adhesive assembly is at least generally out of contact with the edge surface of the microfeature workpiece.

40. The system of claim 37 wherein the microfeature workpiece has a first major surface, a second major surface facing opposite from the first major surface, and an edge surface between the first and second major surfaces, and wherein the system further comprises an electrical link connecting the support member to the microfeature workpiece at the second major surface of the microfeature workpiece.

41. The system of claim 37 wherein the microfeature workpiece includes a first microelectronic die and the adhesive assembly includes a first adhesive assembly, and wherein the system further comprises a second microelectronic die attached to the first microelectronic die with a second adhesive assembly having a composition generally the same as a composition of the first adhesive assembly.

42. The system of claim 37 wherein the microfeature workpiece includes a microelectronic die.

43. The system of claim 37 wherein the microfeature workpiece has a thickness of 150 microns or less.

44. The system of claim 37 wherein the microfeature workpiece has a thickness of 100 microns or less.

45. The system of claim 37 wherein the microfeature workpiece has an aspect ratio of between about one and about ten.

46. A microfeature workpiece system, comprising:

a microfeature workpiece having a first major surface, a second major surface facing away from the first major surface, and an edge surface between the first and second major surfaces;

a support member positioned adjacent to the microfeature workpiece;

an adhesive connected between the support member and the second surface of the microfeature workpiece, the adhesive being at least generally out of contact with the edge surface of the microfeature workpiece; and

an electrical coupling connected between the support member and the second major surface of the micro feature workpiece.

47. The system of claim 46 wherein the microfeature workpiece has a thickness of 100 microns or less.

48. The system of claim 46 wherein the adhesive includes a first layer having a first composition and a first generally uniform thickness, the adhesive further including a second layer having a second composition different than the first composition and having a second generally uniform thickness.

49. The system of claim 46 wherein the adhesive is configured to fail at a location between a first interface and a second interface when the adhesive is subjected to a stress, the first interface being at a junction between the adhesive and the support member, the second interface being at a junction between the adhesive and the microfeature workpiece.

50. A microfeature workpiece system, comprising:

a microfeature workpiece having a first major surface, a second major surface facing away from the first major surface, and an edge surface between the first and second major surfaces;

a support member positioned adjacent to the microfeature workpiece;

an adhesive assembly disposed between the microfeature workpiece and the support member to couple the microfeature workpiece and the support member, the adhesive assembly including a first layer having a first composition and a first generally uniform thickness, the adhesive assembly including a second layer having a second composition different than the first composition and having a second generally uniform thickness, wherein the adhesive assembly is at least generally out of contact with the edge surface of the microfeature workpiece, and wherein the adhesive assembly is configured to fail at a location between a first interface and a second interface when the assembly is subjected to a stress, the first interface being at a juncture of the adhesive assembly and the support member, the second interface being at a juncture of the adhesive assembly and the microfeature workpiece; and

an electrical coupling connected between the support member and the second major surface of the microfeature workpiece.

51. The system of claim 50 wherein the second layer includes an epoxy.

52. A microfeature workpiece assembly, comprising:

a microfeature workpiece having a first major surface, a second major surface facing away from the first major surface, and an edge surface between the first and second major surfaces;

a support means positioned adjacent to the microfeature workpiece; and

adhesive means for adhering the microfeature workpiece to the support means, and having a primary failure mode that is within the adhesive means, between a first interface at a junction between the adhesive means and the microfeature workpiece and a second interface between the adhesive means and the support means.

53. The system of claim 52 wherein the adhesive means is at least generally out of contact with the edge surface of the microfeature workpiece.

54. The system of claim 52, further comprising an electrical link connecting the support means to the microfeature workpiece at the second major surface of the microfeature workpiece.

55. The system of claim 52 wherein the adhesive means includes a first layer having a first chemical composition and a second layer having a second chemical composition different than the first.

56. The system of claim 52 wherein the adhesive means includes a first layer having a first adhesive carried by a film, and wherein the adhesive means further includes a second layer that includes epoxy.

57. The system of claim 52 wherein the microfeature workpiece has a thickness of 100 microns or less.