Semiconductor substrates having useful and transfer layers
First Claim
1. A method of fabricating a final substrate for use in optics, electronics, or optoelectronics which comprises:
- forming a zone of weakness beneath a surface of a source substrate to define a transfer layer;
detaching the transfer layer from the source substrate along the zone of weakness;
depositing a useful layer upon the transfer layer;
obtaining a bilayer consisting of the useful layer and the transfer layer; and
depositing a support material on one of the useful layer or the transfer layer to form the final substrate.
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Abstract
Methods for fabricating final substrates for use in optics, electronics, or optoelectronics are described. The method includes forming a zone of weakness beneath a surface of a source substrate to define a transfer layer; detaching the transfer layer from the source substrate along the zone of weakness; depositing a useful layer upon the transfer layer; and depositing a support material on the useful layer to form the final substrate. The useful layer may be deposited on the transfer layer before or after detaching the transfer layer from the source substrate. The useful layer is typically made of a material having a large band gap, and comprises at least one of gallium nitride, or aluminum nitride, or of compounds of at least two elements including at least one element of aluminum, indium, and gallium. The zone of weakness may advantageously be formed by implanting atomic species into the source substrate.
238 Citations
18 Claims
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1. A method of fabricating a final substrate for use in optics, electronics, or optoelectronics which comprises:
- forming a zone of weakness beneath a surface of a source substrate to define a transfer layer;
detaching the transfer layer from the source substrate along the zone of weakness;
depositing a useful layer upon the transfer layer;
obtaining a bilayer consisting of the useful layer and the transfer layer; and
depositing a support material on one of the useful layer or the transfer layer to form the final substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
- forming a zone of weakness beneath a surface of a source substrate to define a transfer layer;
Specification