Methods for establishing electrical connections by drawing one or both of an element of an electrical connector and a contact toward the other

• US 20060191135A1
• Filed: 04/21/2006
• Published: 08/31/2006
• Est. Priority Date: 02/06/2001
• Status: Abandoned Application

• Current Assignee: John W. Ladd
• Original Assignee: John W. Ladd
• Inventors: Ladd, John W.
• Application Number:
  US11/409,388
• Publication Number:
  US 20060191135A1
• Time in Patent Office: Days
• US Class Current: 29/874
• CPC Class Codes: G01R 1/0416 Connectors, terminals G01R1/0425 and G01R1/0433 take precedence; with measurement function for battery poles G01R31/364
• CPC Class Codes: G01R 31/2831 Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates G01R31/318511 takes precedence; testing during manufacture H01L22/00
• CPC Class Codes: G01R 31/2863 Contacting devices, e.g. sockets, burn-in boards or mounting fixtures in general G01R1/04
• CPC Class Codes: G01R 31/3025 Wireless interface with the DUT
• CPC Class Codes: H01R 13/22 Contacts for co-operating by abutting
• CPC Class Codes: H01R 13/6205 Two-part coupling devices held in engagement by a magnet
• CPC Class Codes: H01R 2201/20 for testing or measuring purposes
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49169 Assembling electrical component directly to terminal or elongated conductor
• CPC Class Codes: Y10T 29/49174 Assembling terminal to elongated conductor
• CPC Class Codes: Y10T 29/49204 Contact or terminal manufacturing

Abstract

A method for establishing an electrical connection includes drawing at least one of a member of an electrical connector and a contact in communication with at least one device. The drawing may be affected nonrigidly. It may occur in a direction substantially normal to a plane of the semiconductor device. Attractive forces, such as magnetic attraction, may cause the drawing. The establishment of electrical connection in this manner may be used in stress testing of semiconductor devices or to otherwise establish an electrical connection between one or more semiconductor devices and a ground, or power source.

Claims

1. A method for establishing a temporary electrical contact with at least one semiconductor device, comprising:

drawing at least one of a first member of an electrical connector and a contact that is in electrical communication with at least one semiconductor device toward the other of the first member and the contact to establish a temporary electrical contact between the first member and the contact.

2. The method of claim 1, wherein drawing is effected in a direction substantially normal to a plane of the contact.

3. The method of claim 1, wherein drawing is effected in a direction substantially normal to a plane of a substrate upon which the contact is carried.

4. The method of claim 1, wherein drawing is effected by positioning a second member of the electrical connector opposite the first member.

5. The method of claim 4, wherein drawing is effected by attracting at least one of the first member and the second member toward at least the other of the first member and the second member.

6. The method of claim 4, wherein drawing comprises securing the first and second members to a substrate upon which the contact is carried.

7. The method of claim 1, wherein drawing comprises securing the first member to the contact.

8. The method of claim 1, wherein drawing comprises magnetically drawing.

9. The method of claim 1, further comprising:

permitting an electrical current to flow from at least one of the electrical connector and the contact to the other of the contact and the electrical connector as the temporary electrical contact is maintained

10. A method for stress testing a plurality of semiconductor devices carried upon a common substrate and in communication with common ground and power contacts, comprising:

drawing at least one of a first member of an electrical connector and at least one contact of a ground contact and a power contact toward the other of the first member and the at least one contact to establish and maintain a temporary electrical contact between the first member and the at least one contact.

11. The method of claim 10, wherein drawing is effected in a direction substantially normal to a plane of the common substrate.

12. The method of claim 10, wherein drawing nonrigidly biases the first member against the at least one contact.

13. The method of claim 10, wherein drawing comprises positioning a second member of the electrical connector opposite the substrate from the first member.

14. The method of claim 13, wherein at least one of the first member and the second member is drawn toward at least the other of the first member and the second member.

15. The method of claim 14, wherein drawing comprises attracting at least one of the first member and the second member toward at least the other of the first member and the second member.

16. The method of claim 10, wherein drawing comprises securing the first member to the at least one contact.

17. The method of claim 10, wherein drawing comprises securing at least the first member in position relative to the substrate.

18. The method of claim 10, wherein drawing comprises magnetically drawing.

19. The method of claim 10, further comprising:

permitting an electrical current to flow from at least one of the electrical connector and the contact to the other of the contact and the electrical connector as the temporary electrical contact is maintained

20. The method of claim 10, further comprising:

electrically connecting another first member of another electrical connector to another of the ground contact and the power contact; and

drawing the another first member toward the another contact.

21. The method of claim 20, further comprising:

applying a substantially constant amount of current to each semiconductor device of the plurality of semiconductor devices through the first member and the another first member.

22. The method of claim 21, further comprising:

heating each of the plurality of semiconductor devices.

23. The method of claim 22, wherein heating comprises cycling a temperature of each of the plurality of semiconductor devices.

24. The method of claim 22, wherein heating comprises varying a temperature of each of the plurality of semiconductor devices.