Inverter apparatus suitable for battery vehicle

• US 20060192509A1
• Filed: 01/24/2006
• Published: 08/31/2006
• Est. Priority Date: 02/25/2005
• Status: Active Grant

• Current Assignee: Mitsubishi Nichiyu Forklift Co., Ltd. (Mitsubishi Heavy Industries, Ltd.)
• Original Assignee: Mitsubishi Heavy Industries, Ltd.
• Inventors: Yamazaki, Hiroyuki, Nakakita, Osamu, Okazaki, Yoshimi
• Granted Patent: US 7,554,817 B2
• Time in Patent Office: Days
• US Class Current: 318/139
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 7/1432 specially adapted for power drive units or power converters
• CPC Class Codes: H05K 7/14322 wherein the control and power circuits of a power converter are arranged within the same casing
• CPC Class Codes: H05K 7/14329 specially adapted for the configuration of power bus bars

Abstract

An inverter apparatus is composed of an insulated metal substrate, a conductive stud, a printed circuit board, a conductive spacer, and a bus bar. An inverter output stage is mounted on the insulated metal substrate. The conductive stud is coupled to a main surface of the insulated metal substrate, and electrically connected with the inverter output stage. The printed circuit board is supported by the stud. The stud is coupled on the rear surface of the printed circuit board. Provided on the main surface of the printed circuit board is a circuit connected to the inverter output stage. The conductive spacer is coupled on the main surface of the printed circuit board, and electrically connected with the stud. The bus bar is coupled to the spacer.

Claims

1. An inverter apparatus comprising:

an insulated metal substrate on which an inverter output stage is mounted;

a conductive stud coupled to a main surface of said insulated metal substrate, and electrically connected with said inverter output stage;

a printed circuit board supported by said stud and having rear and main surfaces, wherein said stud is coupled on said rear surface, and a circuit connected to said inverter output stage is provided on said main surface;

a conductive spacer coupled to said main surface of said printed circuit board, and electrically connected with said stud; and

a bus bar coupled to said spacer.

2. The inverter apparatus according to claim 1, wherein said bus bar is formed of annealed copper.

3. The inverter apparatus according to claim 1, further comprising:

a base plate on which said insulated metal substrate is provided;

an electrode terminal fixed to said base plate,

wherein said electrode terminal includes;

an insulating spacer fixed to said base plate;

a bolt fixed to said insulating spacer;

a conductive terminal spacer through which said bolt is inserted; and

a nut through which said bolt is inserted for securing a terminal of a cable between said nut and said terminal spacer.

4. The inverter apparatus according to claim 3, further comprising a rotation-preventive fitting preventing rotation of said terminal spacer around said bolt,

wherein said bus bar is formed of annealed copper.

5. The inverter apparatus according to claim 4, further comprising a cover in which said insulated metal substrate and said printed circuit board are housed,

wherein said rotation-preventive fitting is disposed between said nut and said terminal spacer, and engaged with said cover.

6. The inverter apparatus according to claim 1, wherein said stud is coupled with said insulated metal substrate through soldering, and

wherein a coupling face between said stud and said insulated metal substrate is circular.

7. The inverter apparatus according to claim 6, wherein said stud includes a cylindrical body portion coupled to said insulated metal substrate, and

wherein said body portion has a diameter of 10 mm or less.

8. The inverter apparatus according to claim 7, wherein said body portion has a height of 12 mm or less.

9. The inverter apparatus according to claim 1, wherein said stud is coupled to said insulated metal substrate through soldering, and

wherein said stud has a cavity open into said coupling face between said stud and said insulated metal substrate.

10. The inverter apparatus according to claim 1, wherein said stud and said spacer are mechanically coupled using threads with said printed circuit board sandwiched therebetween.

11. An inverter apparatus comprising:

a U-phase output stage configured to output a U-phase voltage;

a V-phase output stage configured to output a V-phase voltage;

a W-phase output stage configured to output a W-phase voltage;

a printed circuit board on which a smoothing capacitor for stabilizing a DC power supply voltage fed to said U-phase, V-phase, and W-phase output stages;

a U-phase drive circuit provided on said printed circuit board, and configured to switch power transistors within said U-phase output stage;

a V-phase drive circuit provided on said printed circuit board, and configured to switch power transistors within said V-phase output stage; and

a W-phase drive circuit provided on said printed circuit board, and configured to switch power transistors within said W-phase output stage,

wherein said U-phase drive circuit is positioned adjacent to a first edge of said printed circuit board,

wherein said V-phase drive circuit is positioned adjacent to a second edge of said printed circuit board, and

wherein said W-phase drive circuit is positioned adjacent to a third edge of said printed circuit board.

12. The inverter apparatus according to claim 11, wherein said U-phase drive circuit is connected to said U-phase output stage through a first flat cable,

wherein said V-phase drive circuit is connected to said V-phase output stage through a second flat cable, and

wherein said W-phase drive circuit is connected to said W-phase output stage through a third flat cable.

13. The inverter apparatus according to claim 11, wherein said printed circuit board includes a power supply pattern and a ground pattern,

wherein said smoothing capacitor is electrically connected between said power supply pattern and said ground pattern, and

wherein said DC power supply voltage is maintained between said power supply pattern and said ground pattern.

14. The inverter apparatus according to claim 11, wherein said U-phase, V-phase, and W-phase output stages are mounted on first, second, and third IMS boards, respectively, and

wherein said first to third IMS boards are arranged around a certain center point.

15. An inverter apparatus comprising:

at least one U-phase IMS board associated with a U-phase and mounting a U-phase output stage configured to output a U-phase voltage;

at least one V-phase IMS board associated with a U-phase, and mounting a V-phase output stage configured to output a V-phase voltage; and

at least one W-phase IMS board associated with a W-phase, and mounting a W-phase output stage configured to output a W-phase voltage,

wherein said U-phase, V-phase, and W-phase IMS boards are arranged around a certain center point.

16. The inverter apparatus according to claim 15, wherein said U-phase, V-phase, and W-phase IMS boards are arranged in first, second, and third regions, respectively, and

wherein one of said first, second, and third regions is positioned adjacent to remaining two of said first, second, and third regions.

17. An IMS board receiving a power supply level and a ground level to develop a voltage associated with one phase of a three-phase AC voltage, comprising:

an insulated metal substrate;

a first stud provided on said insulated metal substrate to receive one of said power supply and ground levels;

a second stud provided on said insulated metal substrate to output said voltage associated with said one phase;

at least one third stud provided on said insulted metal substrate to receive another of said power supply and ground levels;

a plurality of first power transistors connected in parallel between said first and second studs; and

a plurality of second power transistors connected in parallel between said second stud and said at least one third stud,

wherein said plurality of first power transistors are arranged in line in a first direction,

wherein said plurality of second power transistors are arranged in line in said first direction,

wherein said first stud is positioned misaligned from a line of said plurality of first power transistors in said first direction,

wherein said second stud is positioned misaligned from a line of said plurality of second power transistors in a second direction opposite to said first direction, and

wherein said at least one third stud is positioned misaligned from said lines of said first and second power transistors in a third direction orthogonal to said first direction.

18. The IMS board according to claim 17, further comprising:

a fourth stud provided on said insulated metal substrate to receive said one of said power supply and ground levels;

a fifth stud provided on said insulated metal substrate to output said voltage associated with said one phase;

a plurality of third power transistors connected in parallel between said fourth and fifth studs, and having the same conductivity type as said plurality of first power transistors; and

a plurality of fourth power transistors connected in parallel between said at least one third stud and said fifth stud, and having the same conductivity type as said plurality of second power transistors,

wherein said first and fourth studs are arranged mirror-symmetrically with respect to a certain symmetry plane,

wherein said second and fifth studs are arranged mirror-symmetrically with respect to said symmetry plane,

wherein said pluralities of first and third power transistors are arranged mirror-symmetrically with respect to said symmetry plane,

wherein said pluralities of second and fourth power transistors are arranged mirror-symmetrically with respect to said symmetry plane, and

wherein said at least one third stud is arranged mirror-symmetrically with respect to said symmetry plane.