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Method and apparatus for detecting defects in wafers

  • US 20060193507A1
  • Filed: 02/28/2005
  • Published: 08/31/2006
  • Est. Priority Date: 02/28/2005
  • Status: Active Grant
First Claim
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1. A method for inspecting a wafer including a multiplicity of dies, the method comprising:

  • dividing an image of at least a portion of said wafer into a plurality of sub-images each representing a sub-portion of said wafer; and

    selecting at least one defect candidate within each said sub-image, by comparing each sub-image to a corresponding sub-image of a reference comprising a representation, which is assumed to be defectless, of said portion of said wafer.

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