Elements for embossing and adhesive application

• US 20060194022A1
• Filed: 05/02/2006
• Published: 08/31/2006
• Est. Priority Date: 03/15/2002
• Status: Abandoned Application

• Current Assignee: Andrew Julian Wnuk, Dean Arthur Zimmerman, Glenn David Boutilier, Jeffrey Scott Ledford, John William Toussant, Linda Evers-Smith, Michael Gomer Jr. Stelljes, Paul Anthony Zaffiro, Paul Dennis Trokhan, Timothy Jude Lorenz
• Original Assignee: Andrew Julian Wnuk, Dean Arthur Zimmerman, Glenn David Boutilier, Jeffrey Scott Ledford, John William Toussant, Linda Evers-Smith, Michael Gomer Jr. Stelljes, Paul Anthony Zaffiro, Paul Dennis Trokhan, Timothy Jude Lorenz
• Inventors: Ledford, Jeffrey Scott, Boutilier, Glenn David, Evers-Smith, Linda, Toussant, John William, Wnuk, Andrew Julian, Trokhan, Paul Dennis, Zimmerman, Dean Arthur, Lorenz, Timothy Jude, Stelljes, Michael Gomer Jr., Zaffiro, Paul Anthony
• Application Number:
  US11/415,728
• Publication Number:
  US 20060194022A1
• Time in Patent Office: Days
• US Class Current: 428/141
• CPC Class Codes: B31F 1/07 Embossing , i.e. producing impressions formed by locally deep-drawing, e.g. using rolls provided with complementary profilesB31F1/128 takes precedence; corrugating B31F1/20; embossing in combination with printing B41F19/02, B41M1/24; typewriters for embossing B41J3/38; stamping in combination with deforming B41K3/36
• CPC Class Codes: B31F 2201/0725 Hardness
• CPC Class Codes: B31F 2201/0728 Material
• CPC Class Codes: B31F 2201/073 Rollers having a multilayered structure
• CPC Class Codes: B31F 2201/0743 having a matching profile
• CPC Class Codes: B31F 2201/0787 Applying adhesive
• CPC Class Codes: Y10S 118/14 Roller, conical
• CPC Class Codes: Y10S 118/15 Roller structure
• CPC Class Codes: Y10T 428/24355 Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]

Abstract

A patterned element for use in an embossing and adhesive application process. The patterened element comprises a material having an pattern disposed thereon, wherein the material comprises a polymer and has a Shore A hardness of greater than about 70, and has a critical surface energy of less than about 30 dynes/cm.

Claims

1. A high speed embossing and adhesive printing process, said process comprising the steps of:

(a) supplying a first embossing roll whose surface comprises a material and having a first embossing pattern disposed thereon, wherein said first embossing roll is engaged with a second embossing roll, said second embossing roll having a second embossing pattern disposed thereon, said first embossing pattern and said second embossing pattern being complementary, wherein said material of the first embossing roll comprises a polymer and has a Shore A hardness of greater than about 70, and has a critical surface energy of less than about 30 dynes/cm;

(b) applying said adhesive to said first embossing roll; and

(c) passing a substrate of sheet material between said first and second embossing rolls to simultaneously emboss said substrate thereby forming a pattern of valleys and land areas and apply said adhesive to said substrate, such that said adhesive forms an adhesive pattern on said valleys between said land areas.

2. The method according to claim 1 wherein said substrate is selected from the group consisting of metal foils, wax paper, polymeric films, non woven webs, fabrics, paper and combinations thereof.

3. The method according to claim 1 wherein said polymer is selected from the group consisting of said polymers are selected from the group consisting of silicones, silicone copolymers, fluoropolymers, fluorinated copolymers, urethane-fluorine copolymers, polyurethane, nitrile rubbers, EP rubber, SBR, EPDM, epoxides, silicone-urethane copolymers, polychloroprene and mixtures thereof.

4. The method according to claim 1 wherein said polymer comprises from about 2% to about 50% by weight of a critical surface energy reducer.

5. The method according to claim 4 wherein said critical surface energy reducer is selected from the group consisting of oils, waxes, gums, resins, particles containing silicone and/or fluorine and combinations thereof.

6. A method for embossing and applying an adhesive to a substrate comprising the step of contacting a substrate of sheet material with an patterned element according to claim 1.

7. An embossed adhesive coated substrate prepared according to the method of claim 6.

8. A method for embossing and applying an adhesive to a substrate comprising

(a) supplying a first embossing roll whose surface comprises a material and having a first embossing pattern disposed thereon, wherein said first embossing roll is engaged with a second embossing roll, said second embossing roll having a second embossing pattern disposed thereon, said first embossing pattern and said second embossing pattern being complementary, wherein said embossment material comprises a polymer and has a Shore A hardness of greater than about 70, and has a critical surface energy of less than about 30 dynes/cm;

(b) applying an adhesive to said first embossing roll;

(c) contacting a substrate of sheet material with said first embossing roll after step (b), whereby said adhesive forms an adhesive pattern on said substrate of sheet material in register with said first embossing pattern of said first embossing roll; and

, (d) passing said substrate of sheet material between said first embossing roll and said second embossing roll wherein said first embossing roll and said second embossing roll emboss said substrate with said complementary embossing pattern thereby forming a pattern of valleys and land areas such that said adhesive pattern is on said valleys between said land areas.

9. The method according to claim 8 wherein said polymer is selected from the group consisting of said polymers are selected from the group consisting of silicones, silicone copolymers, fluoropolymers, fluorinated copolymers, urethane-fluorine copolymers, polyurethane, nitrile rubbers, EP rubber, SBR, EPDM, epoxides, silicone-urethane copolymers, polychloroprene and mixtures thereof.