Microelectronic assemblies having compliancy
First Claim
1. A microelectronic assembly comprising:
- a microelectronic element having a first surface and contacts accessible at the first surface;
a compliant layer overlying the first surface of said microelectronic element;
conductive posts overlying said compliant layer and projecting away from the first surface of said microelectronic element, wherein said conductive posts are electrically interconnected with said contacts of said microelectronic element.
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Accused Products
Abstract
A microelectronic assembly includes a microelectronic element, such as a semiconductor wafer or semiconductor chip, having a first surface and contacts accessible at the first surface, and a compliant layer overlying the first surface of the microelectronic element, the compliant layer having openings in substantial alignment with the contacts of the microelectronic element. The assembly desirably includes conductive posts overlying the compliant layer and projecting away from the first surface of the microelectronic element, the conductive posts being electrically interconnected with the contacts of the microelectronic element by elongated, electrically conductive elements extending between the contacts and the conductive posts.
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Citations
35 Claims
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1. A microelectronic assembly comprising:
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a microelectronic element having a first surface and contacts accessible at the first surface;
a compliant layer overlying the first surface of said microelectronic element;
conductive posts overlying said compliant layer and projecting away from the first surface of said microelectronic element, wherein said conductive posts are electrically interconnected with said contacts of said microelectronic element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27)
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28. A microelectronic assembly comprising:
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a microelectronic element having a first surface and contacts accessible at the first surface;
a compliant layer overlying the first surface of said microelectronic element, said compliant layer having a top surface spaced from the first surface of said microelectronic element;
conductive posts overlying the top surface of said compliant layer and projecting away from the first surface of said microelectronic element;
elongated, conductive elements electrically interconnecting said conductive posts and said contacts of said microelectronic element. - View Dependent Claims (29, 30, 31, 32)
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33. A microelectronic assembly comprising:
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a microelectronic element having a first surface and contacts accessible at the first surface;
a plurality of compliant bumps overlying the first surface of said microelectronic element, each of said compliant bumps being disposed adjacent one of said contacts of said microelectronic element;
conductive posts overlying said microelectronic element and projecting away from the first surface of said microelectronic element;
conductive traces electrically interconnecting said conductive posts and said contacts of said microelectronic element, wherein said compliant bumps enable said conductive posts to move relative to said contacts of said microelectronic element. - View Dependent Claims (34, 35)
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Specification