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Fluidic pump for heat management

  • US 20060196642A1
  • Filed: 12/27/2005
  • Published: 09/07/2006
  • Est. Priority Date: 12/28/2004
  • Status: Active Grant
First Claim
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1. An apparatus, comprising:

  • an electronically operated device;

    a fluid filled conduit, thermally in contact with at least a portion of said heat producing device, and includes a fluid therein;

    a pump, of a type that pumps said fluid through the conduit, but does not extend through any outer walls of the conduit to the inside of the conduit; and

    wherein said fluid filled conduit includes a first portion forming said thermally contact, and includes a second portion which releases heat.

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