Integrated circuit coolant microchannel with compliant cover

• US 20060196646A1
• Filed: 03/01/2005
• Published: 09/07/2006
• Est. Priority Date: 03/01/2005
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Chrysler, Gregory M., Prasher, Ravi, Sauciuc, Ioan, Boyd, Patrick D., Myers, Alan M., Chang, Je-Young, Chiu, Chia-pin
• Granted Patent: US 7,243,705 B2
• Time in Patent Office: Days
• US Class Current: 165/134.1
• CPC Class Codes: F28F 3/12 Elements constructed in the shape of a hollow panel, e.g. with channels F28D1/02, F28D1/03 take precedence
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An apparatus includes a microchannel structure having microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatus also includes a cover positioned on the microchannel structure to define a respective upper wall of each of the microchannels. The cover presents a compliant surface to the microchannels.

Claims

1. An apparatus comprising:

a microchannel structure having microchannels formed therein, said microchannels to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant; and

a cover positioned on the microchannel structure to define a respective upper wall of each of said microchannels, said cover presenting a compliant surface to said microchannels.

2. The apparatus of claim 1, wherein said cover comprises a compliant membrane which spans said microchannels.

3. The apparatus of claim 2, wherein said membrane is formed of polydimethylsiloxane elastomer.

4. The apparatus of claim 2, further comprising a cap member positioned on said microchannel structure with said membrane sandwiched between said cap member and said microchannel structure, said cap member defining a plurality of relief channels each located above a respective one of said microchannels, said membrane forming a bottom wall of each of the relief channels.

5. The apparatus of claim 2, wherein said microchannel structure includes a plurality of opposed walls defining side walls of said microchannels, said membrane adhered to a respective upper surface of each of said opposed walls.

6. The apparatus of claim 1, wherein said cover includes a flexible pad secured to said cover.

7. The apparatus of claim 6, wherein said flexible pad is formed of rubber.

8. The apparatus of claim 1, wherein said cover is formed of a flexible material and is secured to said microchannel structure at perimeter walls of said microchannel structure.

9. The apparatus of claim 8, wherein said flexible material is plastic.

10. The apparatus of claim 9, wherein said flexible material is Teflon.

11. The apparatus of claim 8, wherein said flexible material is bi-metal.

12. The apparatus of claim 11, wherein said flexible material is one of (a) copper-aluminum and (b) aluminum-titanium.

13. The apparatus of claim 1, wherein said cover is a rigid member, and said apparatus further comprising a bias mechanism to downwardly bias said cover toward said microchannel structure, said bias mechanism operative to allow said cover to be compliant to a force applied to said cover upwardly from said microchannels.

14. The apparatus of claim 13, wherein said bias mechanism includes at least one spring.

15. The apparatus of claim 13, further comprising a foil bellows joining a lower periphery of said cover to an upper periphery of said microchannel structure.

16. The apparatus of claim 13, further comprising an O-ring mounted to sealingly close a gap between said cover and said microchannel structure.

17. An apparatus comprising:

a microchannel structure having microchannels formed therein, said microchannels to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant; and

a filler material in said microchannels, said filler material substantially completely obstructing said microchannels at a first temperature, said filler material of a composition that shrinks when heated such that said filler material is in a condition that said microchannels are substantially unobstructed at a second temperature that is higher than the first temperature.

18. The apparatus of claim 17, wherein a total amount of space occupied by said filler material at the second temperature is no more than about 10% of a total amount of space occupied by said filler material at the first temperature.

19. The apparatus of claim 17, wherein said filler material is adhered to a respective upper wall of each of said microchannels.

20. The apparatus of claim 17, wherein the filler material is a solid at both said first and second temperatures.

21. The apparatus of claim 20, wherein the filler material comprises a polymer.

22. The apparatus of claim 21, wherein said filler material comprises n-isopropylacrylamide.

23. An apparatus comprising:

an integrated circuit (IC); and

a microchannel assembly thermally coupled to the IC and having microchannels formed therein, each microchannel defined by a respective plurality of walls, at least one of said walls which defines said each microchannel being formed of a compliant material.

24. The apparatus of claim 23, wherein a respective upper wall of each of the microchannels is formed by a compliant membrane.

25. The apparatus of claim 23, wherein a respective upper wall of each of the microchannels is formed by a rubber pad.

26. A system comprising:

a microprocessor integrated circuit die;

a microchannel structure thermally coupled to the microprocessor integrated circuit die, the microchannel structure having microchannels formed therein, said microchannels to transport a coolant;

a cover positioned on the microchannel structure to define a respective upper wall of each of said microchannels, said cover presenting a compliant surface to said microchannels; and

a chipset in communication with the microprocessor integrated circuit die.

27. The system of claim 26, wherein said cover comprises a compliant membrane which spans said microchannels.

28. The system of claim 26, wherein said cover includes a rubber pad secured to a lower surface of said cover.

29. The system of claim 26, wherein said cover is formed of a flexible material and is secured to said microchannel structure at perimeter walls of said microchannel structure.

30. The system of claim 26, wherein said cover is a rigid member, and said system further comprising a bias mechanism to downwardly bias said cover toward said microchannel structure, said bias mechanism operative to allow said cover to be compliant to a force applied to said cover upwardly from said microchannels.