Buried and bulk channel finFET and method of making the same
First Claim
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1. A fin-field effect transistor, comprising:
- a material stack including a non-inverting surface channel;
a fin of semiconductor material positioned on said material stack, said fin including first and second opposing side surfaces; and
a gate electrode positioned on said first and second opposing side surfaces of said fin.
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Abstract
One embodiment of a fin-field effect transistor includes a material stack including a non-inverting su surface channel, a fin of semiconductor material positioned on the material stack, the fin including first and second opposing side surfaces, and a gate electrode positioned on the first and second opposing side surfaces of the fin.
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Citations
44 Claims
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1. A fin-field effect transistor, comprising:
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a material stack including a non-inverting surface channel;
a fin of semiconductor material positioned on said material stack, said fin including first and second opposing side surfaces; and
a gate electrode positioned on said first and second opposing side surfaces of said fin. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 43, 44)
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39. A multi-gate fin-field effect transistor, comprising:
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a substrate stack including a channel, wherein said channel is chosen from one of a buried channel and a bulk channel;
a fin of semiconductor material positioned on said substrate stack, said fin including first and second opposing side surfaces; and
a gate electrode positioned on said first and second opposing side surfaces of said fin.
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40. A multi-gate fin-field effect transistor, comprising:
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a substrate stack including a non-inverting channel layer;
a fin of semiconductor material positioned on said substrate stack, said fin including first and second opposing side surfaces; and
a gate electrode positioned on said first and second opposing side surfaces of said fin.
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41. A multi-gate fin-field effect transistor, comprising:
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a substrate stack including a channel layer that is depleted during operation;
a fin of semiconductor material positioned on said substrate stack, said fin including first and second opposing side surfaces; and
a gate electrode positioned on said first and second opposing side surfaces of said fin.
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42. A multi-gate fin-field effect transistor, comprising:
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a substrate stack including a channel layer that is depleted during operation;
a fin of semiconductor material positioned on said substrate stack, said fin including first and second opposing side surfaces; and
a gate electrode positioned on said first and second opposing side surfaces of said fin.
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Specification