Semiconductor device, magnetic sensor, and magnetic sensor unit
First Claim
Patent Images
1. A semiconductor device, comprising:
- a semiconductor chip, on the surface of which are formed integrated circuitry and a sensor element, electrically connected thereto;
a pad electrode, formed on the surface side of said semiconductor chip, and electrically connected to at least said integrated circuitry;
an electrode portion, positioned on the surface side of said semiconductor chip, and electrically connecting said semiconductor chip to external circuitry;
a wiring portion, electrically connecting said pad electrode to said electrode portion; and
, an insulating portion, formed from electrically insulating material, which covers the surface of said semiconductor chip and seals said sensor element, wiring portion, and electrode portion, in a state which exposes, at least, said electrode portion on the surface side of said semiconductor chip;
and wherein said electrode portion is placed in a position which does not overlap with said sensor element in the thickness direction of said semiconductor chip.
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Abstract
A semiconductor device, comprising a semiconductor chip; a pad electrode; an electrode portion; a wiring portion. An insulating portion is formed from electrically insulating material, covering the surface of the semiconductor chip and sealing the sensor element, wiring portion and electrode portion, in a state which exposes at least the electrode portion on the surface of the semiconductor chip. The electrode portion is placed in a position which does not overlap with the sensor element in the thickness direction of the semiconductor chip.
11 Citations
8 Claims
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1. A semiconductor device, comprising:
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a semiconductor chip, on the surface of which are formed integrated circuitry and a sensor element, electrically connected thereto;
a pad electrode, formed on the surface side of said semiconductor chip, and electrically connected to at least said integrated circuitry;
an electrode portion, positioned on the surface side of said semiconductor chip, and electrically connecting said semiconductor chip to external circuitry;
a wiring portion, electrically connecting said pad electrode to said electrode portion; and
,an insulating portion, formed from electrically insulating material, which covers the surface of said semiconductor chip and seals said sensor element, wiring portion, and electrode portion, in a state which exposes, at least, said electrode portion on the surface side of said semiconductor chip;
and wherein said electrode portion is placed in a position which does not overlap with said sensor element in the thickness direction of said semiconductor chip. - View Dependent Claims (2, 3, 4, 5)
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6. A semiconductor device, comprising:
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a semiconductor chip, on the surface of which are formed integrated circuitry and a sensor element, electrically connected thereto;
a pad electrode, formed on the surface side of said semiconductor chip, and electrically connected to at least said integrated circuitry;
a plurality of electrode portions, positioned on the surface side of said semiconductor chip, and electrically connecting said semiconductor chip to external circuitry;
a wiring portion, electrically connecting said pad electrode to said electrode portions; and
,an insulating portion, formed from electrically insulating material, which covers the surface of said semiconductor chip and seals said sensor element, wiring portion, and electrode portions, in a state which exposes, at least, said electrode portions on the surface side of said semiconductor chip;
and wherein said electrode portions comprise protruding portions which protrude from said insulating portion in the thickness direction of said semiconductor chip; and
,one protruding portion placed adjacently to said sensor element has a smaller protrusion length from said insulating portion compared with other protruding portions placed at a distance from said sensor element.
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7. A semiconductor device, comprising:
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a semiconductor chip, on the surface of which are formed integrated circuitry and a sensor element, electrically connected thereto;
a pad electrode, formed on the surface side of said semiconductor chip, and electrically connected to at least said integrated circuitry;
a plurality of electrode portions, positioned on the surface side of said semiconductor chip, and electrically connecting said semiconductor chip to external circuitry;
a wiring portion, electrically connecting said pad electrode to said electrode portions; and
,an insulating portion, formed from electrically insulating material, which covers the surface of said semiconductor chip and seals said sensor element, wiring portion, and electrode portions, in a state which exposes, at least, said electrode portions on the surface side of said semiconductor chip;
and wherein said electrode portions comprise protruding portions which protrude from said insulating portion in the thickness direction of said semiconductor chip; and
,one protruding portion placed adjacently to said sensor element is formed from conductive material with a lower melting point compared with other protruding portions placed at a distance from said sensor element.
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8. A semiconductor device, comprising:
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a semiconductor chip, on the surface of which are formed integrated circuitry and a sensor element, electrically connected thereto;
a pad electrode, formed on the surface side of said semiconductor chip, and electrically connected to at least said integrated circuitry;
a plurality of electrode portions, positioned on the surface side of said semiconductor chip, and electrically connecting said semiconductor chip to external circuitry;
a wiring portion, electrically connecting said pad electrode to said electrode portions; and
,an insulating portion, formed from electrically insulating material, which covers the surface of said semiconductor chip and seals said sensor element, wiring portion, and electrode portions, in a state which exposes, at least, said electrode portions on the surface side of said semiconductor chip;
and wherein said electrode portions comprise protruding portions which protrude from said insulating portion in the thickness direction of said semiconductor chip;
said protruding portions comprise a substantially spherical core formed from a conductive material and a shell portion, covering the periphery of the core, and formed from a conductive material with a melting point lower than the melting point of said conductive material; and
,the core of one protruding portion placed adjacent to said sensor element is formed to be smaller than the cores of other protruding portions placed at a distance from said sensor element, and moreover diameters of the shell portions of said one protruding portion and of said other protruding portions are substantially equal.
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Specification