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Method of fabricating wafer-level packaging with sidewall passivation and related apparatus

  • US 20060197190A1
  • Filed: 04/21/2006
  • Published: 09/07/2006
  • Est. Priority Date: 01/29/2004
  • Status: Active Grant
First Claim
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1. An apparatus comprising:

  • a frame;

    a membrane coupled to the frame and configured to adhere to a surface of a semiconductor wafer, wherein the frame is configured to stretch the membrane in at least one lateral direction while the semiconductor wafer is adhered thereto.

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