Electronic device components including protective layers on surfaces thereof

• US 20060197235A1
• Filed: 04/27/2006
• Published: 09/07/2006
• Est. Priority Date: 06/08/2000
• Status: Abandoned Application

• Current Assignee: Alan G. Wood, Warren M. Farnworth
• Original Assignee: Alan G. Wood, Warren M. Farnworth
• Inventors: Farnworth, Warren M., Wood, Alan G.
• Application Number:
  US11/413,414
• Publication Number:
  US 20060197235A1
• Time in Patent Office: Days
• US Class Current: 257/787
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: B33Y 30/00 Apparatus for additive manufacturing; Details thereof or accessories therefor
• CPC Class Codes: B33Y 80/00 Products made by additive manufacturing
• CPC Class Codes: H01L 21/44 Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/38 - H01L21/428
• CPC Class Codes: H01L 2224/29099 Material
• CPC Class Codes: H01L 23/3157 Partial encapsulation or coating mask layer used as insulation layer H01L21/31
• CPC Class Codes: H01L 23/3192 Multilayer coating
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00013 Fully indexed content
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An electronic device component, such as a semiconductor element device or semiconductor device component includes on selected portions of a surface thereof. One or more conductive features may be exposed through the protective element. The protective element includes a plurality of adjacent, mutually adhered regions. The adjacent, mutually adhered regions may comprise the same material. They may be substantially free of voids or air pockets. The electronic device may be an individual component or it may be physically secured to one or more other components, such as devices that have yet to be singulated from a large-scale substrate, such as a full or partial wafer or a strip or array of carriers.

Claims

1. In combination, a substrate including a plurality of components and a protective element on selected portions of at least one component of the plurality, the protective element including a plurality of adjacent, mutually adhered regions comprising the same material.

2. The combination of claim 1, wherein the substrate carries the plurality of components.

3. The combination of claim 2, wherein at least one component of the plurality comprises a semiconductor device.

4. The combination of claim 1, wherein the substrate comprises a semiconductor substrate.

5. The combination of claim 1, wherein the protective element is substantially discontinuous from protective elements on adjacent components of the plurality.

6. The combination of claim 1, wherein the protective element comprises at least one of a curable polymer, a thermoplastic material, and an adhesive.

7. The combination of claim 1, wherein the protective element substantially covers a surface of a corresponding component of the plurality.

8. The combination of claim 7, wherein each protective element substantially covers a surface of a corresponding component of the plurality.

9. The combination of claim 1, wherein conductors of the at least one component are exposed through the protective element.

10. The combination of claim 9, wherein the conductors comprise contact pads.

11. An electronic component, comprising:

a substrate with at least one conductor on a surface thereof; and

a plurality of adjacent, mutually adhered regions comprising of at least semisolid dielectric material on the surface, the plurality adjacent, mutually adhered regions being substantially free of voids and air pockets, the at least one conductor being electrically exposed through the plurality of adjacent, mutually adhered regions.

12. The electronic component of claim 11, wherein the at least one conductor is laterally surrounded by the at least semisolid dielectric material.

13. The electronic component of claim 12, wherein the at least one conductor is recessed beneath an outer surface of the plurality of adjacent, mutually adhered regions.

14. The electronic component of claim 11, wherein an outer surface of the plurality of adjacent, mutually adhered regions is substantially planar.

15. The electronic component of claim 11, wherein an outer surface of the plurality of adjacent, mutually adhered regions is substantially parallel to the surface of the substrate.

16. The electronic component of claim 11, wherein the substrate comprises at least one semiconductor die.

17. The electronic component of claim 11, wherein the substrate carries a plurality of components.

18. The electronic component of claim 17, wherein the substrate comprises a large-scale fabrication substrate.

19. The electronic component of claim 17, wherein the at least semisolid dielectric material does not reside over streets located between adjacent components.

20. The electronic component of claim 11, comprising an adhesive material

21. The electronic component of claim 20, wherein the plurality of adjacent, mutually adhered regions comprises the adhesive material.

22. The electronic component of claim 20, wherein the adhesive material is on at least a portion of an outer surface of the plurality of adjacent, mutually adhered regions.

23. The electronic component of claim 20, wherein the adhesive material comprises thermoplastic material.

24. The electronic component of claim 11, wherein all regions of the plurality of adjacent, mutually adhered regions comprise the same material.