Construction of saw devices

• US 20060197407A1
• Filed: 03/05/2004
• Published: 09/07/2006
• Est. Priority Date: 03/10/2003
• Status: Abandoned Application

• Current Assignee: Transense Technologies Plc
• Original Assignee: Transense Technologies Plc
• Inventors: Freakes, Graham Michael, Lee, Mark, Leigh, Arthur John, Lohr, Raymond David, Vile, David Daniel George
• Application Number:
  US10/547,913
• Publication Number:
  US 20060197407A1
• Time in Patent Office: Days
• US Class Current: 310/313.00R
• CPC Class Codes: G01L 1/165 with acoustic surface waves
• CPC Class Codes: G01L 9/0025 with acoustic surface waves
• CPC Class Codes: Y10T 29/42 Piezoelectric device making
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

A silicon or quartz wafer for forming a SAW device is the subject of grinding and lapping operation to form its basic shape. The opposing surfaces, as well as the edges extending therebetween, are the polished to reduce the number and size of defects in the surfaces. Metal is deposited onto one of the opposing surfaces which, in use, will be under compression, to form electronic components thereon, and a multi-metallic coating having an outer layer formed of gold is applied to the other surface to form a solder pad by means of which the wafer may be fastened to a shaft or the like by soldering. Martensitic stainless steel is used as a mount, saddle or housing for the SAW substrate.

Claims

1-16. -16. (canceled)

17. An apparatus comprising a packaging for a SAW substrate at least partially formed of martensitic stainless steel.

18. The packaging according to claim 17, wherein said stainless steel is hardened.

19. The packaging according to claim 17, wherein said stainless steel is 17-7PH or 17-4PH stainless steel.

20. The packaging according to claim 17, wherein the packaging includes a first section on which, in use, the SAW substrate is carried, which is formed of said martensitic stainless steel.

21. The packaging according to claim 17, having a chamber formed therein for receiving a SAW device.

22. A device for protecting a substrate in a non-environmentally-isolating package, comprising:

a sensor including a SAW substrate; and

a martensitic stainless steel mount coupled to said SAW substrate,

wherein said martensitic stainless steel mount possesses a high elastic range so that said sensor is able to monitor the environment through said mount.

23. The device according to claim 22, wherein said martensitic stainless steel mount includes precipitation hardened martensitic stainless steel.

24. The device according to claim 22, wherein the matensitic stainless steel is selected from the group consisting of 17-7PH stainless steel and 17-4PH stainless steel.

25. The device according to claim 22, wherein said martensitic stainless steel mount comprises a saddle for fastening the sensor to a structural component.

26. The device according to claim 22, wherein said martensitic stainless steel mount comprises a housing that encloses said sensor.