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WAFER BONDING OF THINNED ELECTRONIC MATERIALS AND CIRCUITS TO HIGH PERFORMANCE SUBSTRATE

  • US 20060199353A1
  • Filed: 11/22/2005
  • Published: 09/07/2006
  • Est. Priority Date: 07/12/2002
  • Status: Active Grant
First Claim
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1. A method of bonding a wafer to a substrate comprising the steps of:

  • providing a wafer having a front surface and a back surface;

    attaching the front surface of the wafer to a support;

    thinning the wafer from the back surface;

    bonding the back surface of the wafer to a substrate using a thin bonding technique; and

    removing the support from the front surface of the wafer.

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