Wired circuit board
First Claim
1. A wired circuit board comprising a metal suspension board, a thin metal film formed on the metal suspension board, a metal foil formed on the thin metal film, an insulating layer formed on the metal foil, and a conductive pattern formed on the insulating layer.
1 Assignment
0 Petitions
Accused Products
Abstract
A wired circuit board that can provide a reduced transmission loss and an improved adhesion strength between a metal suspension board and a metal foil with a simple laminar structure, thereby ensuring improved long-term reliability. The wired circuit board 1 comprises a metal suspension board 2, a thin metal film 3 formed on the metal suspension board 2 by sputtering or by electrolytic plating, a metal foil 4 formed on the thin metal film 3 by electrolytic plating, an insulating base layer 5 formed on the metal foil 4 and the metal suspension board 2, and a conductive pattern 6 formed on the insulating base layer 5 as a wired circuit pattern. The wired circuit board 1 may include an insulating cover layer 7 formed on the insulating base layer 5 to cover the conductive pattern 6.
33 Citations
4 Claims
- 1. A wired circuit board comprising a metal suspension board, a thin metal film formed on the metal suspension board, a metal foil formed on the thin metal film, an insulating layer formed on the metal foil, and a conductive pattern formed on the insulating layer.
Specification
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- Resources
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Current AssigneeNitto Denko Corporation
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Original AssigneeNitto Denko Corporation
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InventorsIshii, Jun, Kanagawa, Hitoki, Funada, Yasuhito
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Granted Patent
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Time in Patent OfficeDays
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Field of Search
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US Class Current439/66
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CPC Class CodesH05K 1/056 the metal substrate being c...H05K 2201/0317 Thin film conductor layer; ...H05K 2201/0338 Layered conductor, e.g. lay...H05K 2203/0723 Electroplating, e.g. finish...
