Apparatus and method for forming vias
First Claim
Patent Images
1. An apparatus for forming vias in one or more layers, comprising:
- a) one or more beams located in alignment with said layers for forming one or more vias in one or more areas of the layers; and
b) a vacuum mechanism for collecting ablated material caused by said directed beams forming said one or more vias, said vacuum mechanism being in fixed alignment with respect to said one or more beams such that said vacuum applies a removal force on said ablated material at the time and location when said one or more vias is being formed.
2 Assignments
0 Petitions
Accused Products
Abstract
An apparatus and method for forming vias in one or more layers, comprising one or more beams located in alignment with the layers for forming one or more vias in one or more areas of the layers. A vacuum mechanism is provided for collecting ablated material caused by the directed beams forming the one or more vias, the vacuum mechanism being in fixed alignment with respect to the one or more beams such that the vacuum applies a removal force on the ablated material at the time and location when the one or more vias is being formed.
22 Citations
93 Claims
-
1. An apparatus for forming vias in one or more layers, comprising:
-
a) one or more beams located in alignment with said layers for forming one or more vias in one or more areas of the layers; and
b) a vacuum mechanism for collecting ablated material caused by said directed beams forming said one or more vias, said vacuum mechanism being in fixed alignment with respect to said one or more beams such that said vacuum applies a removal force on said ablated material at the time and location when said one or more vias is being formed. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 76)
-
-
13. The apparatus of claim 111 wherein said beams each include an optical element for focusing light on the layer.
-
32. A method of making an OLED device comprising the steps of:
-
a) providing a substrate;
b) forming one or more first electrodes and electrode busses on the substrate;
c) forming one or more organic layers over the first electrodes and electrode busses;
d) ablating a plurality of areas of the material layer for forming vias using at least one beam in a chamber; and
e) collecting the ablated material with a vacuum mechanism having a trap having one or more orifices, wherein said one or more orifices are located in close proximity to said plurality of areas at the time of ablation so that a collection force is applied to the debris formed during ablation of said material. - View Dependent Claims (33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62)
-
-
63. A method for forming vias in one or more layers, comprising:
-
a) forming one or more vias in one or more areas of the layers using one or more beams located in alignment with said layers; and
b) collecting ablated material caused by said directed beams forming said one or more vias using a vacuum mechanism wherein said vacuum mechanism is in fixed alignment with respect to said one or more beams such that said vacuum applies a removal force on said ablated material at the time and location when said one or more vias is being formed. - View Dependent Claims (64, 65, 66, 67, 68, 69, 70, 71, 72, 73, 74, 75, 77, 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93)
-
Specification