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Flip chip mounting substrate

  • US 20060201703A1
  • Filed: 07/30/2004
  • Published: 09/14/2006
  • Est. Priority Date: 08/05/2003
  • Status: Active Grant
First Claim
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1. A flip chip mounting substrate which comprises an electronic circuit composed of a circuit line and plural mounting pads connected to both ends of the circuit line formed on one surface of a base sheet, wherein the plural mounting pads are faced each other and spaced a pad clearance gap apart, and one or more semiconductor mounting paste guide paths are formed in the mounting pads.

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