Flip chip mounting substrate

• US 20060201703A1
• Filed: 07/30/2004
• Published: 09/14/2006
• Est. Priority Date: 08/05/2003
• Status: Active Grant

• Current Assignee: Lintec Corporation
• Original Assignee: Lintec Corporation
• Inventors: Matsushita, Taiga, Matsuura, Katsuyoshi, Nakata, Yasukazu
• Granted Patent: US 7,397,672 B2
• Time in Patent Office: Days
• US Class Current: 174/260
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The present invention provides a flip chip mounting substrate which comprises an electronic circuit composed of a circuit line and plural mounting pads connected to both ends of the circuit line formed on one surface of a base sheet, wherein the plural mounting pads are faced each other and spaced a pad clearance gap apart, and one or more semiconductor mounting paste guide paths are formed in the mounting pads. The flip chip mounting substrate can reduce voids that might be produced in the semiconductor mounting paste, when flip-chip-mounting an IC chip on a flip chip mounting substrate.

Claims

1. A flip chip mounting substrate which comprises an electronic circuit composed of a circuit line and plural mounting pads connected to both ends of the circuit line formed on one surface of a base sheet, wherein the plural mounting pads are faced each other and spaced a pad clearance gap apart, and one or more semiconductor mounting paste guide paths are formed in the mounting pads.

2. The flip chip mounting substrate as claimed in claim 1, wherein a width of the semiconductor mounting paste guide path is in the range from 50 to 600 μ

m.

3. The flip chip mounting substrate as claimed in claim 1, wherein a broad section for pressing out and spreading uniformly the semiconductor mounting paste to connecting to an IC ship is formed in a pat of the pad clearance gap.

4. The flip chip mounting substrate as claimed in claim 3, wherein a thin film layer is formed in center section of the broad section.