METHODS FOR REMOVING EXTRANEOUS AMOUNTS OF MOLDING MATERIAL FROM A SUBSTRATE

• US 20060201910A1
• Filed: 05/30/2006
• Published: 09/14/2006
• Est. Priority Date: 12/22/2004
• Status: Abandoned Application

• Current Assignee: Nordson Corporation
• Original Assignee: Nordson Corporation
• Inventors: Zhao, Jiangang, Getty, James D.
• Application Number:
  US11/420,840
• Publication Number:
  US 20060201910A1
• Time in Patent Office: Days
• US Class Current: 216/57
• CPC Class Codes: B29C 59/14 by plasma treatment plasma tubes per se H01J
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 3/288 Removal of non-metallic coatings, e.g. for repairing

Abstract

Methods for removing thin layers of extraneous multi-component molding material from one or more areas on a substrate. The methods include exposing the substrate to a plasma effective to remove a non-particulate component of the molding material from each area. The methods further include exposing the substrate to a non-plasma process effective to remove a particulate component of the molding material from the area.

Claims

1. A method for removing amounts of a molding material having a particulate component and a non-particulate component from an area on a substrate, the method comprising:

exposing the substrate to a plasma effective to remove the non-particulate component of the molding material from the area; and

exposing the substrate to a non-plasma process effective to remove the particulate component of the molding material from the area.

2. The method of claim 1 wherein exposing the substrate to the non-plasma process comprises:

contacting the molding material in the area with a cleaning solution effective to remove the particulate component from the area.

3. The method of claim 2 wherein contacting the molding material in the area with the cleaning solution further comprises:

providing sonic wave energy to the cleaning solution for enhancing removal of the particulate component from the area.

4. The method of claim 2 wherein contacting the molding material in the area with the cleaning solution further comprises:

brushing the molding material in the area while the molding material is in contact with the cleaning solution.

5. The method of claim 2 wherein contacting the molding material in the area with the cleaning solution further comprises:

contacting the molding material in the area with de-ionized water.

6. The method of claim 2 wherein contacting the molding material in the area with the cleaning solution further comprises:

at least partially immersing the substrate in a bath of the cleaning solution to wet the area with the cleaning solution.

7. The method of claim 2 wherein contacting the molding material in the area with the cleaning solution further comprises:

submerging the substrate in a bath of the cleaning solution.

8. The method of claim 2 wherein contacting the molding material in the area with the cleaning solution further comprises:

spraying the molding material in the area with the cleaning solution.

9. The method of claim 2 wherein contacting the molding material in the area with the cleaning solution further comprises:

flowing the cleaning solution across the molding material in the area.

10. The method of claim 1 wherein exposing the area of the substrate to the non-plasma process comprises:

brushing the molding material in the area to remove the particulate component from the area.

11. The method of claim 1 wherein exposing the area of the substrate to the non-plasma process comprises:

impinging molding material in the area with one or more high pressure air jets that remove the particulate component from the area.

12. The method of claim 1 wherein exposing the area of the substrate to the non-plasma process comprises:

directing a beam of radiation from a laser at the molding material in the area of the substrate for vaporizing the particulate component.

13. The method of claim 12 further comprising:

supplying a reactive gas to the area to promote chemical reactions between the beam of radiation and the particulate component.

14. The method of claim 1 wherein exposing the area of the substrate to the non-plasma process comprises:

directing infrared radiation to the molding material in the area to promote heating of the particulate component.

15. The method of claim 1 wherein exposing the area of the substrate to the non-plasma process comprises:

directing a cryogenic fluid to the molding material in the area of the substrate.

16. The method of claim 1 wherein exposing the area of the substrate to the non-plasma process comprises:

removing or reversing an electrostatic charge on the particulate component in the area.

17. The method of claim 1 wherein exposing the area of the substrate to the non-plasma process comprises:

contacting the molding material in the area with a polishing pad and a slurry carried on the polishing pad that are effective for removing the particulate component from the area.