LED mounting having increased heat dissipation
First Claim
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1. An LED assembly comprising:
- a substrate having a heat-sink pad forming a bottom surface thereof, an LED mounted at least partially on said substrate and having a portion of said LED physically bonded to the heat sink pad; and
wire bond pads on a top surface of said substrate, said wire bond pads electrically connected to said LED.
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Abstract
There is disclosed a system and method for increasing heat dissipation of LED displays by using the current PCB packaging mounted to a LCD panel support structure thereby eliminating the need for a metal core PCB. In one embodiment, reverse mounted LEDs having heat dissipation pads are used to optimize heat transfer to a metal layer which is then placed in contact with the LCD support structure.
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Citations
20 Claims
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1. An LED assembly comprising:
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a substrate having a heat-sink pad forming a bottom surface thereof, an LED mounted at least partially on said substrate and having a portion of said LED physically bonded to the heat sink pad; and
wire bond pads on a top surface of said substrate, said wire bond pads electrically connected to said LED. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. An array of LEDs, said array comprising:
a first substrate having reflector cups constructed therein, said reflector cups for mounting said LEDs therein;
said first substrate having attached thereto a heat conducting layer in physical contact with a first surface of mounted ones of said LEDs;
said first substrate comprising;
electrical pads for connecting to mounted ones of said LEDs, said electrical pads positioned so as to communicate electrical control signals from a mating substrate, said mating substrate having constructed therein control circuitry for controlling said LEDs;
said LED array further comprising;
a heat conducting support structure in non-electrical contact with said heat conducting layer so as to transfer away heat generate from the operation of mounted ones of said LEDs. - View Dependent Claims (11, 12, 13, 14)
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15. A method of constructing an LED array, said method comprising:
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constructing in a first substrate a reflector area for mounting an LED therein, said reflector area containing a heat transfer material in contact with a bottom surface of said first substrate; and
constructing on a top surface of said first substrate contact pads for connecting with electrical contacts of a mounted LED, said contact pads also having area for making electrical contact with electrical contacts on a second substrate in contact with said top surface of said first substrate;
positioning said LED within said reflector area with a bottom surface of said LED that is physically bonded to said heat transfer material.
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- 16. (canceled)
Specification