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LED mounting having increased heat dissipation

  • US 20060202210A1
  • Filed: 03/08/2005
  • Published: 09/14/2006
  • Est. Priority Date: 03/08/2005
  • Status: Active Grant
First Claim
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1. An LED assembly comprising:

  • a substrate having a heat-sink pad forming a bottom surface thereof, an LED mounted at least partially on said substrate and having a portion of said LED physically bonded to the heat sink pad; and

    wire bond pads on a top surface of said substrate, said wire bond pads electrically connected to said LED.

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