Wireless chip and electronic appliance having the same

• US 20060202269A1
• Filed: 02/16/2006
• Published: 09/14/2006
• Est. Priority Date: 03/08/2005
• Status: Abandoned Application

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Suzuki, Yukie, Arai, Yasuyuki, Yamazaki, Shunpei
• Application Number:
  US11/354,825
• Publication Number:
  US 20060202269A1
• Time in Patent Office: Days
• US Class Current: 257/347
• CPC Class Codes: H01L 21/84 the substrate being other than a semiconductor body, e.g. being an insulating body
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 27/1214 comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
• CPC Class Codes: H01L 27/1255 integrated with passive devices, e.g. auxiliary capacitors
• CPC Class Codes: H01L 27/13 combined with thin-film or thick-film passive components
• CPC Class Codes: H01L 29/78621 with LDD structure or an extension or an offset region or characterised by the doping profile
• CPC Class Codes: H01L 29/78675 with normal-type structure, e.g. with top gate
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 9/0407 Substantially flat resonant element parallel to ground plane, e.g. patch antenna dipole H01Q9/285; monopole H01Q9/40
• CPC Class Codes: H01Q 9/27 Spiral antennas

Abstract

The present invention provides a wireless chip having high mechanical strength. Moreover, the present invention also provides a wireless chip which can prevent an electric wave from being blocked. In a wireless chip of the present invention, a layer having a thin film transistor formed over an insulating substrate is fixed to an antenna by an anisotropic conductive adhesive, and the thin film transistor is connected to the antenna. The antenna has a dielectric layer, a first conductive layer, and a second conductive layer; the first conductive layer and the second conductive layer has the dielectric layer therebetween; the first conductive layer serves as a radiating electrode; and the second electrode serves as a ground contact body.

Claims

1. A wireless chip comprising:

a layer having a thin film transistor formed over an insulating substrate;

a connection terminal which is formed on a surface of the layer having the thin film transistor and which is connected to the thin film transistor;

an antenna having a first conductive layer, a second conductive layer serving as a ground contact body, and a dielectric layer sandwiched between the first conductive layer and the second conductive layer; and

a connection layer for electrically connecting the antenna and the connection terminal.

2. A wireless chip according to claim 1,

wherein the layer having the thin film transistor is formed by stacking plural layers having thin film transistors.

3. A wireless chip according to claim 1,

wherein, over the insulating substrate, a region where the layer having the thin film transistor is to be formed is different from a region where the antenna is to be provided.

4. A wireless chip according to claim 1,

wherein the wireless chip has a high-frequency circuit.

5. A wireless chip according to claim 1,

wherein the wireless chip has a microprocessor.

6. A wireless chip according to claim 1,

wherein the wireless chip has a detection element.

7. A wireless chip according to claim 1,

wherein the insulating substrate is a glass substrate.

8. A wireless chip according to claim 1,

wherein the dielectric layer is formed with one or more selected from alumina, glass, forsterite, barium titanate, lead titanate, strontium titanate, lead zirconate, lithium niobate, and lead zirconium titanate.

9. A wireless chip according to claim 1,

wherein the dielectric layer is formed with one or more selected from an epoxy resin, a phenol resin, a polybutadiene resin, a bismaleimide triazine resin, vinylbenzyl, and polyfumarate.

10. An electronic appliance having the wireless chip according to claim 1.

11. An electronic appliance according to claim 10,

wherein the electronic appliance is a liquid crystal display device, an EL display device, a television device, a mobile phone, a printer, a camera, a personal computer, a earphone-equipped goggle, a speaker device, a headphone, a navigation device, or an electronic key.

12. A wireless chip according to claim 1 wherein the connection layer comprises an organic resin layer having a conductive particle.

13. A wireless chip according to claim 1 wherein the connection layer comprises a third conductive layer.

14. A wireless chip comprising:

a layer having a thin film transistor formed over an insulating substrate;

a first connection terminal and a second connection terminal which are formed on a surface of the layer having the thin film transistor and which are connected to the thin film transistor;

an antenna having a dielectric layer, a first conductive layer on a first plane of the dielectric layer, a second conductive layer serving as a ground contact body on a second plane which opposes to the first plane through the dielectric layer, and a third conductive layer serving as a power feeding body formed on the first plane, the second plane, and a third plane which is in contact with the first plane and the second plane; and

a connection layer for electrically connecting the first connection terminal and the second conductive layer, and for electrically connecting the second connection terminal and the third conductive layer.

15. A wireless chip according to claim 14,

wherein the layer having the thin film transistor is formed by stacking plural layers having thin film transistors.

16. A wireless chip according to claim 14,

wherein, over the insulating substrate, a region where the layer having the thin film transistor is to be formed is different from a region where the antenna is to be provided.

17. A wireless chip according to claim 14,

wherein the wireless chip has a high-frequency circuit.

18. A wireless chip according to claim 14,

wherein the wireless chip has a microprocessor.

19. A wireless chip according to claim 14,

wherein the wireless chip has a detection element.

20. A wireless chip according to claim 14,

wherein the insulating substrate is a glass substrate.

21. A wireless chip according to claim 14,

wherein the dielectric layer is formed with one or more selected from alumina, glass, forsterite, barium titanate, lead titanate, strontium titanate, lead zirconate, lithium niobate, and lead zirconium titanate.

22. A wireless chip according to claim 14,

wherein the dielectric layer is formed with one or more selected from an epoxy resin, a phenol resin, a polybutadiene resin, a bismaleimide triazine resin, vinylbenzyl, and polyfumarate.

23. An electronic appliance having the wireless chip according to claim 14.

24. An electronic appliance according to claim 23,

wherein the electronic appliance is a liquid crystal display device, an EL display device, a television device, a mobile phone, a printer, a camera, a personal computer, a earphone-equipped goggle, a speaker device, a headphone, a navigation device, or an electronic key.

25. A wireless chip according to claim 14 wherein the connection layer comprises an organic resin layer having a conductive particle.

26. A wireless chip according to claim 14 wherein the connection layer comprises a fourth conductive layer.

27. A wireless chip comprising:

a layer having a thin film transistor formed over an insulating substrate;

a first connection terminal which is formed on a surface of the layer having the thin film transistor and which is connected to the thin film transistor;

a layer having one or more passive elements selected from an inductor, a capacitor, and a resistor;

a second connection terminal formed on a first plane of the layer having the one or more passive elements;

a third connection terminal formed on a second plane which opposes to the first plane;

a first connection layer for electrically connecting the first connection terminal and the second connection terminal;

an antenna having a first conductive layer, a second conductive layer serving as a ground contact body, and a dielectric layer sandwiched between the first conductive layer and the second conductive layer; and

a second connection layer for electrically connecting the third connection terminal and the antenna.

28. A wireless chip according to claim 27,

wherein the layer having the thin film transistor is formed by stacking plural layers having thin film transistors.

29. A wireless chip according to claim 27,

wherein, over the insulating substrate, a region where the layer having the thin film transistor is to be formed is different from a region where the antenna is to be provided.

30. A wireless chip according to claim 27,

wherein the wireless chip has a high-frequency circuit.

31. A wireless chip according to claim 27,

wherein the wireless chip has a microprocessor.

32. A wireless chip according to claim 27,

wherein the wireless chip has a detection element.

33. A wireless chip according to claim 27,

wherein the insulating substrate is a glass substrate.

34. A wireless chip according to claim 27,

wherein the dielectric layer is formed with one or more selected from alumina, glass, forsterite, barium titanate, lead titanate, strontium titanate, lead zirconate, lithium niobate, and lead zirconium titanate.

35. A wireless chip according to claim 27,

wherein the dielectric layer is formed with one or more selected from an epoxy resin, a phenol resin, a polybutadiene resin, a bismaleimide triazine resin, vinylbenzyl, and polyfumarate.

36. An electronic appliance having the wireless chip according to claim 27.

37. An electronic appliance according to claim 36,

wherein the electronic appliance is a liquid crystal display device, an EL display device, a television device, a mobile phone, a printer, a camera, a personal computer, a earphone-equipped goggle, a speaker device, a headphone, a navigation device, or an electronic key.

38. A wireless chip according to claim 27 wherein the first connection layer comprises a first organic resin layer having a first conductive particle, and the second connection layer comprises a second organic resin layer having a second conductive particle.

39. A wireless chip according to claim 27 wherein the first connection layer comprises a third conductive layer, and the second connection layer comprises a fourth conductive layer.

40. A wireless chip comprising:

a first layer having a first thin film transistor formed over an insulating substrate;

a first connection terminal which is formed on a surface of the first layer and which is connected to the first thin film transistor;

a second layer having a second thin film transistor;

a second connection terminal formed on a first plane of the second layer;

a third connection terminal formed on a second plane which opposes to the first plane;

a first connection layer for electrically connecting the first connection terminal and the second connection terminal;

an antenna having a first conductive layer, a second conductive layer serving as a ground contact body, and a dielectric layer sandwiched between the first conductive layer and the second conductive layer; and

a second connection layer for electrically connecting the third connection terminal and the antenna.

41. A wireless chip according to claim 40,

wherein, over the insulating substrate, a region where the first layer and the second layer are to be formed is different from a region where the antenna is to be provided.

42. A wireless chip according to claim 40,

wherein the first layer, and the second layer have thicknesses from 1 μ

m to 10 μ

m.

43. A wireless chip according to claim 40,

wherein the first layer, and the second layer have thicknesses from 1 μ

m to 5 μ

m.

44. A wireless chip according to claim 40,

wherein the wireless chip has a high-frequency circuit.

45. A wireless chip according to claim 40,

wherein the wireless chip has a microprocessor.

46. A wireless chip according to claim 40,

wherein the wireless chip has a detection element.

47. A wireless chip according to claim 40,

wherein the insulating substrate is a glass substrate.

48. A wireless chip according to claim 40,

wherein the dielectric layer is formed with one or more selected from alumina, glass, forsterite, barium titanate, lead titanate, strontium titanate, lead zirconate, lithium niobate, and lead zirconium titanate.

49. A wireless chip according to claim 40,

wherein the dielectric layer is formed with one or more selected from an epoxy resin, a phenol resin, a polybutadiene resin, a bismaleimide triazine resin, vinylbenzyl, and polyfumarate.

50. An electronic appliance having the wireless chip according to claim 40.

51. An electronic appliance according to claim 50,

wherein the electronic appliance is a liquid crystal display device, an EL display device, a television device, a mobile phone, a printer, a camera, a personal computer, a earphone-equipped goggle, a speaker device, a headphone, a navigation device, or an electronic key.

52. A wireless chip according to claim 40 wherein the first connection layer comprises a first organic resin layer having a first conductive particle, and the second connection layer comprises a second organic resin layer having a second conductive particle.

53. A wireless chip according to claim 40 wherein the first connection layer comprises a third conductive layer, and the second connection layer comprises a fourth conductive layer.

54. A wireless chip comprising:

a first layer having a first thin film transistor formed over an insulating substrate;

a first connection terminal which is formed on a surface of the first layer and which is connected to the first thin film transistor;

a second layer having a second thin film transistor;

a second connection terminal formed on a first plane of the second layer;

a third connection terminal formed on a second plane of the second layer which opposes to the first plane;

a first connection layer for electrically connecting the first connection terminal and the second connection terminal;

a layer having one or more passive elements selected from an inductor, a capacitor, and a resistor;

a fourth connection terminal formed on a first plane of the layer having the one or more passive elements;

a fifth connection terminal formed on a second plane of the layer having the one or more passive elements which opposes to the first plane;

a second connection layer for electrically connecting the third connection terminal and the fourth connection terminal;

an antenna having a first conductive layer, a second conductive layer serving as a ground contact body, and a dielectric layer sandwiched between the first conductive layer and the second conductive layer; and

a third connection layer for electrically connecting the fifth connection terminal and the antenna.

55. A wireless chip according to claim 54,

wherein, over the insulating substrate, a region where the first layer and the second layer are to be formed is different from a region where the antenna is to be provided.

56. A wireless chip according to claim 54,

wherein the first layer, and the second layer have thicknesses from 1 μ

m to 10 μ

m.

57. A wireless chip according to claim 54,

wherein the first layer, and the second layer have thicknesses from 1 μ

m to 5 μ

m.

58. A wireless chip according to claim 54,

wherein the wireless chip has a high-frequency circuit.

59. A wireless chip according to claim 54,

wherein the wireless chip has a microprocessor.

60. A wireless chip according to claim 54,

wherein the wireless chip has a detection element.

61. A wireless chip according to claim 54,

wherein the insulating substrate is a glass substrate.

62. A wireless chip according to claim 54,

wherein the dielectric layer is formed with one or more selected from alumina, glass, forsterite, barium titanate, lead titanate, strontium titanate, lead zirconate, lithium niobate, and lead zirconium titanate.

63. A wireless chip according to claim 54,

wherein the dielectric layer is formed with one or more selected from an epoxy resin, a phenol resin, a polybutadiene resin, a bismaleimide triazine resin, vinylbenzyl, and polyfumarate.

64. An electronic appliance having the wireless chip according to claim 54.

65. An electronic appliance according to claim 64,

wherein the electronic appliance is a liquid crystal display device, an EL display device, a television device, a mobile phone, a printer, a camera, a personal computer, a earphone-equipped goggle, a speaker device, a headphone, a navigation device, or an electronic key.

66. A wireless chip according to claim 54 wherein the first connection layer comprises a first organic resin layer having a first conductive particle, and the second connection layer comprises a second organic resin layer having a second conductive particle, and the third connection layer comprises a third organic resin layer having a third conductive particle.

67. A wireless chip according to claim 54 wherein the first connection layer comprises a third conductive layer, and the second connection layer comprises a fourth conductive layer, and the third connection layer comprises a fifth conductive layer.

68. A wireless chip comprising:

a layer which is formed over an insulating substrate and which has a first thin film transistor, a second thin film transistor, and a first antenna connected to the first thin film transistor;

a connection terminal which is formed over a surface of the layer having the first thin film transistor, the second thin film transistor, and the first antenna connected to the first thin film transistor and which is connected to the second thin film transistor;

a second antenna having a first conductive layer, a second conductive layer serving as a ground contact body, and a dielectric layer sandwiched between the first conductive layer and the second conductive layer; and

a connection layer for electrically connecting the connection terminal and the second antenna.

69. A wireless chip according to claim 68,

wherein the wireless chip has a high-frequency circuit.

70. A wireless chip according to claim 68,

wherein the wireless chip has a microprocessor.

71. A wireless chip according to claim 68,

wherein the wireless chip has a detection element.

72. A wireless chip according to claim 68,

wherein the insulating substrate is a glass substrate.

73. A wireless chip according to claim 68,

wherein the dielectric layer is formed with one or more selected from alumina, glass, forsterite, barium titanate, lead titanate, strontium titanate, lead zirconate, lithium niobate, and lead zirconium titanate.

74. A wireless chip according to claim 68,

wherein the dielectric layer is formed with one or more selected from an epoxy resin, a phenol resin, a polybutadiene resin, a bismaleimide triazine resin, vinylbenzyl, and polyfumarate.

75. An electronic appliance having the wireless chip according to claim 68.

76. An electronic appliance according to claim 75,

wherein the electronic appliance is a liquid crystal display device, an EL display device, a television device, a mobile phone, a printer, a camera, a personal computer, a earphone-equipped goggle, a speaker device, a headphone, a navigation device, or an electronic key.

77. A wireless chip according to claim 68 wherein the connection layer comprises an organic resin layer having a conductive particle.

78. A wireless chip according to claim 68 wherein the connection layer comprises a third conductive layer.