Touchpad with single-layered printed circuit board structure

• US 20060202970A1
• Filed: 11/16/2005
• Published: 09/14/2006
• Est. Priority Date: 03/11/2005
• Status: Active Grant

• Current Assignee: Elan Microelectronics Corporation
• Original Assignee: Elan Microelectronics Corporation
• Inventors: Chiu, Yen-Chang, Chien, Yung-Lieh, Lii, Jia-Yih
• Granted Patent: US 8,149,219 B2
• Time in Patent Office: Days
• US Class Current: 345/173
• CPC Class Codes: G06F 3/03547 Touch pads, in which fingers can move on a surface

Abstract

In a touchpad with single-layered PCB structure, a PCB has a bottom layer with a sensor area and a component area thereon, the sensor area includes two directional traces directly connected to the component area, respectively, and carbon film wires in the sensor area for interconnecting one or more of the directional traces.

Claims

1. A touchpad with single-layered printed circuit board structure, comprising:

a PCB having a bottom layer;

a sensor area on the bottom layer; and

a component area on a periphery of the sensor area.

2. The touchpad according to claim 1, further comprising an insulator cover over the sensor area for providing an operation area.

3. The touchpad according to claim 1, further comprising an insulator cover over a top layer of the PCB at a location facing to the sensor area for providing an operation area.

4. The touchpad according to claim 1, wherein the PCB comprises a top layer having an operation area thereon at a location facing to the sensor area.

5. The touchpad according to claim 1, wherein the sensor area comprises a plurality of first and second directional traces directly connected to the component area, respectively.

6. The touchpad according to claim 3, further comprising a plurality of carbon film wires in the sensor area for interconnecting one or more of the plurality of first or second directional traces.