Aqueous carbon nanotube applicator liquids and methods for producing applicator liquids thereof
First Claim
Patent Images
1. An applicator liquid comprising:
- one or more carbon nanotubes and a liquid medium comprising water, wherein the carbon nanotubes are distributed in the liquid medium without substantial precipitation, flocculation or other macroscopic interaction.
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Abstract
Certain applicator liquids and method of making the applicator liquids are described. The applicator liquids can be used to form nanotube films or fabrics of controlled properties. An applicator liquid for preparation of a nanotube film or fabric includes a controlled concentration of nanotubes dispersed in a liquid medium containing water. The controlled concentration is sufficient to form a nanotube fabric or film of preselected density and uniformity.
162 Citations
65 Claims
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1. An applicator liquid comprising:
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one or more carbon nanotubes and a liquid medium comprising water, wherein the carbon nanotubes are distributed in the liquid medium without substantial precipitation, flocculation or other macroscopic interaction. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
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29. A method for making an applicator liquid, the method comprising:
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a) contacting one or more carbon nanotubes with a liquid medium comprising water to obtain a mixture; and
b) removing impurities from the carbon nanotubes to obtain the applicator liquid, wherein the applicator liquid meets or exceeds specifications for use in class 1 semiconductor fabrication facility. - View Dependent Claims (30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60)
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61. A method for making an applicator liquid:
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a) contacting one or more carbon nanotubes with a liquid medium comprising water and an acid to obtain a mixture;
b) contacting the mixture with a base; and
c) removing soluble and particulate impurities, wherein the applicator liquid meets or exceeds specifications for use in class 1 semiconductor fabrication facility. - View Dependent Claims (62, 63, 64, 65)
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Specification