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Radio frequency identification (RFID) tag lamination process

  • US 20060205113A1
  • Filed: 03/14/2005
  • Published: 09/14/2006
  • Est. Priority Date: 03/14/2005
  • Status: Abandoned Application
First Claim
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1. A method of constructing an RFID unit comprising:

  • attaching an integrated circuit chip to a substrate with an antenna unit using an adhesive; and

    laminating a protective layer over at least part of the integrated circuit chip while the adhesive has not yet fully set.

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