×

Radio frequency identification (RFID) tag lamination process using liner

  • US 20060205115A1
  • Filed: 11/22/2005
  • Published: 09/14/2006
  • Est. Priority Date: 03/14/2005
  • Status: Active Grant
First Claim
Patent Images

1. A method of constructing an RFID unit comprising:

  • attaching an integrated circuit chip to a substrate with an antenna unit using an adhesive;

    laminating a protective layer with a liner over at least part of the integrated circuit chip while the adhesive has not yet fully set; and

    removing the liner from the protective layer.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×