Methods for fabricating electronic device components that include protruding contacts and electronic device components so fabricated
First Claim
1. A method for fabricating a probe card, comprising:
- forming a sacrificial layer over a surface of a fabrication substrate;
forming at least one elongate contact over the sacrificial layer;
forming a support plate laterally around an intermediate section of the at least one elongate contact; and
removing the sacrificial layer to facilitate removal of the at least one contact from the fabrication substrate.
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Accused Products
Abstract
A method for fabricating a semiconductor device component, such as a probe card, includes providing a support plate with at least one aperture therethrough and providing at least one contact in the at least one aperture. Ends of the at least one contact may be enlarged to retain the same within the at least one aperture. A protective structure may be provided to prevent excessive compression of the at least one contact. The support plate, all or part of the at least one contact, the protective structure, or a combination thereof may be formed by a programmed material consolidation process, such as stereolithography, in which unconsolidated material is selectively consolidated in accordance with a program.
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Citations
50 Claims
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1. A method for fabricating a probe card, comprising:
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forming a sacrificial layer over a surface of a fabrication substrate;
forming at least one elongate contact over the sacrificial layer;
forming a support plate laterally around an intermediate section of the at least one elongate contact; and
removing the sacrificial layer to facilitate removal of the at least one contact from the fabrication substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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- 13. A method for fabricating a probe card, selectively consolidating unconsolidated material to form at least a portion of at least one of a support plate and a contact of the probe card.
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21. A method for fabricating a probe card, comprising:
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forming a sacrificial layer over a surface of a fabrication substrate;
forming at least one elongate contact over the sacrificial layer;
selectively consolidating unconsolidated material in accordance with a program to form a support plate laterally around an intermediate section of the at least one elongate contact; and
removing the sacrificial layer to facilitate removal of the at least one contact from the fabrication substrate. - View Dependent Claims (22, 23, 24)
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25. A method for fabricating a probe card, comprising:
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providing a substrate including at least one aperture therethrough;
fabricating an outer shell of a contact to extend through the at least one aperture; and
introducing conductive material into a channel extending through the outer shell. - View Dependent Claims (26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40)
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41. A method for fabricating a probe card, comprising:
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providing a substrate including at least one aperture therethrough;
forming at least one contact to extend through the at least one aperture, enlarged ends of the at least one contact configured to retain the at least one contact within the at least one aperture, the act of forming including;
forming an outer shell of the at least one contact; and
forming a conductive element of the at least one contact, the conductive element extending through at least a portion of the outer shell.
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42. A semiconductor device component, comprising:
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a substrate;
at least one flexible, resilient contact protruding from at least one surface of the substrate; and
at least one protective structure positioned on the at least one surface so as to prevent deformation of the at least one flexible, resilient contact beyond an elastic limit thereof. - View Dependent Claims (43, 44, 45, 46, 47, 48, 49, 50)
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Specification