Micro liquid cooling device

• US 20060207752A1
• Filed: 03/15/2005
• Published: 09/21/2006
• Est. Priority Date: 03/15/2005
• Status: Abandoned Application

• Current Assignee: Inventec Corporation
• Original Assignee: Inventec Corporation
• Inventors: Chen, Yong-Guo, Chiu, Chaucer
• Application Number:
  US11/079,339
• Publication Number:
  US 20060207752A1
• Time in Patent Office: Days
• US Class Current: 165/104.330
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A micro liquid cooling device including a radiator, a thermal conductor, an actuator, and a circular path is proposed. The actuator includes a cavity sealed with a thin film, an inlet diffusion port connected to the cavity, an outlet diffusion port connected to the cavity, a magnetic body connected to the thin film, and a pole acting on the magnetic body, such that circulation of a liquid coolant in the circular path can be effected. By such design of the actuator, vibration and noise can be reduced and reliability can be improved, and thus problems caused by the use of a prior-art technique which employs a piezoelectric pump as an actuation source for the liquid coolant can be solved.

Claims

1. A micro liquid cooling device for dissipating heat generated by at least a heat-producing element, the device comprising:

a radiator;

a thermal conductor for receiving heat transferred from the heat-producing element;

an actuator having a cavity sealed with a thin film, an inlet diffusion port connected to the cavity, an outlet diffusion port connected to the cavity, a magnetic body connected to the thin film, and a pole acting on the magnetic body; and

a circuitous path for circulating a liquid coolant from the outlet diffusion port to the inlet diffusion port via the thermal conductor and the radiator.

2. The micro liquid cooling device of claim 1, wherein the thin film is a high polymer film.

3. The micro liquid cooling device of claim 2, wherein the high polymer film is a polyethylene film.

4. The micro liquid cooling device of claim 1, wherein an inner aperture of the inlet diffusion port connected to the cavity is larger than an outer aperture of the inlet diffusion port.

5. The micro liquid cooling device of claim 4, wherein the inlet diffusion port is a funnel-shaped port capable of drawing in liquid.

6. The micro liquid cooling device of claim 1, wherein an inner aperture of the outlet diffusion port connected to the cavity is smaller than an outer aperture of the outlet diffusion port.

7. The micro liquid cooling device of claim 6, wherein the outlet diffusion port is a funnel-shaped nozzle.

8. The micro liquid cooling device of claim 1, wherein the magnetic body is a permanent magnet.

9. The micro liquid cooling device of claim 8, wherein the permanent magnet is a thin film structure or a thin layered structure.

10. The micro liquid cooling device of claim 1, wherein the pole is an electric coil.

11. The micro liquid cooling device of claim 1, wherein the circular path is a pipe.

12. The micro liquid cooling device of claim 11, wherein the pipe is a metal pipe characterized with thermal conductivity.

13. The micro liquid cooling device of claim 1, wherein the thermal conductor is a lid structure provided on the heat-producing element.

14. The micro liquid cooling device of claim 1, wherein the thermal conductor is a flat structure covering on the heat-producing element.

15. The micro liquid cooling device of claim 1, further comprising a storage container connected to the circular path for supplying the liquid coolant.

16. The micro liquid cooling device of claim 15, wherein the storage container is a water tank.