Organic semiconductor device and producing method therefor
First Claim
1. An organic semiconductor device comprising:
- a source electrode;
a drain electrode; and
a p-type organic semiconductor layer sandwiched between the source electrode and the drain electrode, characterized by further comprising an n-type organic semiconductor layer formed in an intermediate portion of the p-type organic semiconductor layer; and
a gate electrode embedded in the n-type organic semiconductor layer.
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Accused Products
Abstract
The invention provides an organic semiconductor device with a p-type organic semiconductor layer sandwiched between a source electrode and a drain electrode including an n-type organic semiconductor layer formed in an intermediate portion of the p-type organic semiconductor layer and a gate electrode embedded in the n-type organic semiconductor layer, and an organic semiconductor device with an n-type organic semiconductor layer sandwiched between a source electrode and a drain electrode includes a p-type organic semiconductor layer formed in an intermediate portion of the n-type organic semiconductor layer and a gate electrode embedded in the p-type organic semiconductor layer, thereby suppressing a leak current generated between the electrodes. The invention also provides an organic semiconductor device including an organic semiconductor layer sandwiched between a source electrode and a drain electrode and having a carrier transporting property, and a gate electrode constituted of at least two intermediate electrode pieces which are embedded in the organic semiconductor layer, are respectively provided in at least two planes separated from and parallel to the source electrode and the drain electrode, and are positioned in a direction across the layer thickness. The gate electrode is embedded by fusing the organic semiconductor layer.
41 Citations
14 Claims
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1. An organic semiconductor device comprising:
- a source electrode;
a drain electrode; and
a p-type organic semiconductor layer sandwiched between the source electrode and the drain electrode, characterized by further comprising an n-type organic semiconductor layer formed in an intermediate portion of the p-type organic semiconductor layer; and
a gate electrode embedded in the n-type organic semiconductor layer. - View Dependent Claims (2, 3)
- a source electrode;
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4. An organic semiconductor device comprising:
- a source electrode;
a drain electrode; and
a n-type organic semiconductor layer sandwiched between the source electrode and the drain electrode, characterized by further comprising a p-type organic semiconductor layer formed in an intermediate portion of said n-type organic semiconductor layer and a gate electrode embedded in said p-type organic semiconductor layer. - View Dependent Claims (5, 6)
- a source electrode;
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7. An organic semiconductor device comprising:
- a source electrode;
a drain electrode; and
an organic semiconductor layer sandwiched between the source electrode and the drain electrode and having a carrier transporting property, characterized by further comprising a gate electrode constituted of at least two intermediate electrode pieces which are embedded in the organic semiconductor layer, wherein the intermediate electrode pieces are respectively provided in at least two planes separated from and parallel to the source electrode and the drain electrode, and are positioned in a direction across the layer thickness. - View Dependent Claims (8, 9, 10, 11)
- a source electrode;
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12. A method for producing an organic semiconductor device provided with an organic semiconductor layer formed between a source electrode and a drain electrode and embedding a gate electrode therein, the method being characterized by comprising:
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a first organic semiconductor layer laminating step of forming a first organic semiconductor layer on either of a source electrode and a drain electrode;
a first intermediate electrode piece laminating step of forming a first intermediate electrode piece on a part of the first organic semiconductor layer;
a second organic semiconductor layer laminating step of forming a second organic semiconductor layer on the first organic semiconductor layer and the first intermediate electrode piece;
a second intermediate electrode piece laminating step of forming a second intermediate electrode piece on a part of the second organic semiconductor layer so as to cover the source electrode and the drain electrode in a complementary manner with the first intermediate electrode piece; and
a third organic semiconductor layer laminating step of forming a third organic semiconductor layer on the second organic semiconductor layer and the second intermediate electrode piece;
wherein each of the second and third organic semiconductor layer laminating step includes an embedding step of softening the formed organic semiconductor and embedding the intermediate electrode piece therein. - View Dependent Claims (13, 14)
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Specification