Wiring board and method of manufacturing the same

• US 20060208356A1
• Filed: 03/10/2006
• Published: 09/21/2006
• Est. Priority Date: 03/15/2005
• Status: Active Grant

• Current Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Original Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Inventors: Iizuka, Hajime, Yamano, Takaharu, Sunohara, Masahiro, Koyama, Tetsuya
• Granted Patent: US 7,884,484 B2
• Time in Patent Office: Days
• US Class Current: 257/734
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2221/68345 used as a support during the manufacture of self supporting substrates
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/1134 Stud bumping, i.e. using a wire-bonding apparatus
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/136 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/81005 being a temporary or sacrificial substrate
• CPC Class Codes: H01L 2224/81191 wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/8121 using a reflow oven
• CPC Class Codes: H01L 2224/81815 Reflow soldering
• CPC Class Codes: H01L 2224/83102 using surface energy, e.g. capillary forces
• CPC Class Codes: H01L 2224/92125 the second connecting process involving a layer connector
• CPC Class Codes: H01L 23/18 Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/49805 the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
• CPC Class Codes: H01L 23/49816 : Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/5383 : Multilayer substrates H01L23/5385 takes precedence; multilayer metallisation on monolayer substrates H01L23/538
• CPC Class Codes: H01L 23/5389 : the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 25/0655 : the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00013 : Fully indexed content
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/15192 : Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15331 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/3511 : Warping
• CPC Class Codes: H01L 2924/381 : Pitch distance
• CPC Class Codes: H05K 1/185 : Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit semiconductor chips encapsulated by interconnect and support structures H01L23/5389, H01L24/00
• CPC Class Codes: H05K 3/4644 : by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49135 : and shaping, e.g., cutting or bending, etc.
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49156 : with selective destruction of conductive paths

Abstract

A wiring board includes an insulating layer in which a semiconductor chip is embedded, and a wiring structure connected to the semiconductor chip. A reinforcing member reinforcing the insulating layer is embedded in the insulating layer. This enables reduction in a thickness of the wiring board and a suppression of warpage of the wiring board.

Claims

1. A wiring board comprising:

at least one semiconductor chip;

an insulating layer in which said at least one semiconductor chip is embedded;

a wiring structure being connected to the semiconductor chip; and

at least one reinforcing member for reinforcing the insulating layer, the reinforcing member being embedded in the insulating layer.

2. The wiring board according to claim 1, wherein the reinforcing member and the semiconductor chip are mounted on substantially a same plane.

3. The wiring board according to claim 1, wherein the reinforcing member is formed so as to surround the semiconductor chip.

4. The wiring board according to claim 1, wherein

said at least one reinforcing member includes a plurality of reinforcing members, and

the plurality of reinforcing members is formed on both end portions of the wiring board.

5. The wiring board according to claim 1, wherein

said at least one reinforcing member includes a plurality of reinforcing members, and

the plurality of reinforcing members is formed in vicinities of corner portions of the wiring board.

6. The wiring board according to claim 1, wherein the wiring structure has a multilayer wiring structure.

7. The wiring board according to claim 1, wherein the wiring structure includes:

a first wiring substructure being formed on a first side of the semiconductor chip; and

a second wiring substructure being formed on a second side of the semiconductor chip.

8. The wiring board according to claim 7, wherein the first wiring substructure and the second wiring substructure are connected by a via plug being formed in the insulating layer.

9. The wiring board according to claim 1, further comprising:

a first terminal connection portion formed on a first surface of the wiring board, the fist terminal connection portion being connected to the semiconductor chip through the wiring structure; and

a second terminal connection portion formed on a second surface of the wiring board, the second terminal connection portion being connected to the semiconductor chip through the wiring structure.

10. The wiring board according to claim 1, wherein the reinforcing member is made of an organic core material or a metal material.

11. A method of manufacturing a wiring board, said method comprising:

forming a lower-layer wiring structure;

mounting at least one semiconductor chip on the lower-layer wiring structure, and connecting the semiconductor chip to the lower-layer wiring structure;

forming at least one reinforcing member; and

forming an insulating layer so as to embed the semiconductor chip and the reinforcing member in the insulating layer, the reinforcing member reinforcing the insulating layer.

12. The method of manufacturing the wiring board according to claim 11, wherein the reinforcing member and the semiconductor chip are mounted on substantially a same plane.

13. The method of manufacturing the wiring board according to claim 11, further comprising:

forming a via plug in the insulating layer, and connecting the via plug to the lower-layer wiring structure; and

forming an upper-layer wiring structure so that the semiconductor chip is mounted between the lower-layer wiring structure and the upper-layer wiring structure, and connecting the upper-layer wiring structure to the via plug.

14. The method of manufacturing the wiring board according to claim 11, wherein the lower-layer wiring structure is formed on a core board, and

the method further comprises:

removing the core board.

15. The method of manufacturing the wiring board according to claim 14, wherein the core board is made of an electrically conductive material, and

the forming step of the lower-layer wiring structure includes forming the lower-layer wiring structure by electrolytic plating using the core board as an electrode.

16. The method of manufacturing the wiring board according to claim 11, wherein the semiconductor chip is electrically connected to the lower-layer wiring structure through a stud bump being formed on the semiconductor chip.

17. The method of manufacturing the wiring board according to claim 16, further comprising:

forming a connecting portion made of solder between the stud bump and the lower-layer wiring structure.

18. The method of manufacturing the wiring board according to claim 11, wherein the forming step of the insulating layer includes:

forming a first insulating layer so as to cover the semiconductor chip and the lower-layer wiring structure; and

forming a second insulating layer so as to cover the semiconductor chip and the reinforcing member, the reinforcing member being formed on the first insulating layer.

19. The method of manufacturing the wiring board according to claim 18, further comprising:

curing the first insulating layer and the second insulating layer by heat,

wherein the first insulating layer and the second insulating layer are made of heat-hardening resin material.