Method of coupling wireless portable communications device to electronicmail server by public wireless communications network when out of communication with private wireless communications
First Claim
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1. A process for curing a one-component adhesive/sealant comprising at least one surface-deactivated solid polyisocyanate, said process comprising exposing the adhesive/sealant to microwave radiation, wherein the adhesive/sealant is heated to a material temperature below the thickening temperature.
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Abstract
One-component adhesives/sealants comprising surface-deactivated solid polyisocyanates and, optionally, isocyanate-reactive, liquid binders can be rapidly cured below the conventional thickening temperature by irradiating with microwaves, for example microwaves of at least 2 wavelengths. This process is particularly suitable for adhesively joining plastic substrates.
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21 Claims
- 1. A process for curing a one-component adhesive/sealant comprising at least one surface-deactivated solid polyisocyanate, said process comprising exposing the adhesive/sealant to microwave radiation, wherein the adhesive/sealant is heated to a material temperature below the thickening temperature.
- 19. A process for adhesively joining a first plastic substrate and a second plastic substrate using a one-component adhesive/sealant comprising at least one surface-deactivated solid polyisocyanate, said process comprising curing the adhesive/sealant by exposing the adhesive/sealant to microwave radiation, wherein the adhesive/sealant is heated to a material temperature below the thickening temperature.
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