LIGHT EMITTING MODULE AND RELATED LIGHT SOURCE DEVICE

• US 20060209545A1
• Filed: 01/04/2006
• Published: 09/21/2006
• Est. Priority Date: 03/18/2005
• Status: Active Grant

• Current Assignee: Gold Charm Limited (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Hon Hai Precision Industry Co., Ltd.
• Inventors: Yu, Tai-Cheng
• Granted Patent: US 7,318,660 B2
• Time in Patent Office: Days
• US Class Current: 362/294
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 29/51 using condensation or evaporation of a fluid, e.g. heat pipes
• CPC Class Codes: F21V 29/52 electrically powered, e.g. refrigeration systems
• CPC Class Codes: F21V 29/58 characterised by the coolants
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A light emitting module (10) includes a metal circuit board (11), a number of light emitting units (12) arranged on a first surface of the metal circuit board, and a cooling system (13) mounted on an opposite second surface of the metal circuit board. A light source device (1) using the light emitting module further includes a housing (30) and a transparent light cover (20). The housing has a base with the light emitting module being mounted thereon. The transparent light cover covers the housing. The present light emitting module and light source device can improve the brightness of the light, and increase the utilization efficiency of light.

Claims

1. A light emitting module, comprising:

a metal circuit board;

a plurality of light emitting units arranged on a first surface of the metal circuit board; and

a cooling system mounted on an opposite second surface of the metal circuit board.

2. The light emitting module as claimed in claim 1, wherein the cooling system comprises a hollow heat receiving portion attached to the second surface of the metal circuit board, a cooling pipe defining a liquid passage in communication with the heat receiving portion, and a cooling liquid received in the liquid passage.

3. The light emitting module as claimed in claim 2, wherein the cooling pipe is one of a curved pipe and a spiral pipe.

4. The light emitting module as claimed in claim 2, wherein the cooling system further comprises a pump arranged in the liquid passage for enhancing the flow of the cooling liquid in the liquid passage.

5. The light emitting module as claimed in claim 2, wherein the cooling system further comprises a cooling tank arranged in the liquid passage for supplying the cooling liquid and enhancing the cooling efficiency of the cooling liquid.

6. The light emitting module as claimed in claim 2, wherein the cooling system further comprises a thermal interface material applied between the metal circuit board and the heat receiving portion.

7. The light emitting module as claimed in claim 6, wherein the thermal interface material is incorporated with nanomaterials.

8. The light emitting module as claimed in claim 2, wherein the cooling liquid is one of water and supercritical liquid.

9. The light emitting module as claimed in claim 1, wherein the light emitting units are white light emitting units.

10. The light emitting module as claimed in claim 9, wherein each of the white light emitting units comprises a plurality of color light emitting diodes, or color laser diodes.

11. The light emitting module as claimed in claim 10, wherein the white light emitting unit comprises the plurality of color light emitting diodes, and the plurality of color light emitting diodes is arranged in an order selected from the group consisting of G-R-B-R-G, R-G-B-G-R, B-G-R-G-B, B-R-G-R-B, or G-B-R-B-G.

12. The light emitting module as claimed in claim 10, wherein the white light emitting unit comprises the plurality of color laser diodes, and the plurality of color laser diodes are arranged in an order selected from the group consisting of G-R-B-R-G, R-G-B-G-R, B-G-R-G-B, B-R-G-R-B, and G-B-R-B-G.

13. The light emitting module as claimed in claim 1, wherein the metal circuit board is a metal printed circuit board.

14. The light emitting module as claimed in claim 1, wherein the metal circuit board is comprised of heat conducting material with a high heat conducting property.

15. The light emitting module as claimed in claim 14, wherein the heat conducting material is selected from the group consisting of Cu, Al and theirs alloy.

16. A light source device, comprising:

a light emitting module comprising a metal circuit board, a plurality of light emitting units arranged on a first surface of the metal circuit board, and a cooling system mounted on an opposite second surface of the metal circuit board;

a housing having a base with the light emitting module being mounted thereon; and

a transparent light cover covering the housing.

17. The light source device as claimed in claim 16, wherein the cooling system comprises a hollow heat receiving portion attached to the bottom of the metal circuit board, a cooling pipe defining a liquid passage in communication with the heat receiving portion, and a cooling liquid received in the liquid passage.

18. The light source device as claimed in claim 16, wherein an inner surface of the housing is a reflective surface for reflecting the light emitted from the light emitting module to the outside of the housing.