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Semiconductor component and method for fabricating it

  • US 20060209586A1
  • Filed: 02/23/2006
  • Published: 09/21/2006
  • Est. Priority Date: 02/23/2005
  • Status: Active Grant
First Claim
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1. A semiconductor component comprising:

  • semiconductor body including a trench structure, the trench structure including at least two trench regions disposed adjacent to each other, at least one trench region including at least a part of an electrode structure, the electrode structure being embedded in the trench structure and at least partly insulated from its surroundings by an insulation structure, wherein the two trench regions are oriented relative to one another in such a way that at least portions of the insulation structure which are provided in an upper region of the two trench regions overlap one another in an overlap region; and

    wherein a contact hole is arranged above the at least two trench regions in such a way that at least parts of the overlap region and at least one electrode structure part are contact-connected via the contact hole.

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