Priming module for microfluidic chips

• US 20060211134A1
• Filed: 05/24/2006
• Published: 09/21/2006
• Est. Priority Date: 03/02/2001
• Status: Abandoned Application

• Current Assignee: Caliper Life Sciences Incorporated (Revvity, Inc.)
• Original Assignee: Caliper Life Science Incorporated
• Inventors: Kennedy, Michael J., Gefter, Alexander A.
• Application Number:
  US11/440,507
• Publication Number:
  US 20060211134A1
• Time in Patent Office: Days
• US Class Current: 436/180
• CPC Class Codes: B01L 2200/023 adapted for different sizes of tubes, tips or container
• CPC Class Codes: B01L 2200/027 for microfluidic devices
• CPC Class Codes: B01L 2400/0487 fluid pressure, pneumatics
• CPC Class Codes: B01L 3/0293 for liquids
• CPC Class Codes: B01L 3/5027 by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip B01L3/5023 takes precedence; micromixers B01F33/30; microreactors for synthesis B01J19/0093; microcapillary devices in general B81B1/00
• CPC Class Codes: B01L 9/527 for microfluidic devices, e.g. used for lab-on-a-chip
• CPC Class Codes: Y10T 436/2575 Volumetric liquid transfer

Abstract

Methods and apparatuses for priming sample substrates such as DNA sipper chips are disclosed. According to one aspect of the present invention, a priming system that is suitable for priming a substrate which has a plurality of wells and at least one channel includes a base unit and a top unit. The base unit is arranged to accommodate, or support, the substrate. The top unit, which is substantially physically separate from the base unit, fits over the substrate when the substrate is held by the base unit. The top unit includes an adapter portion that interfaces with the substrate. Included in the adapter portion is a first cavity that is used to facilitate pressurizing a first well of the substrate when the adapter portion is interfaced with the substrate such that the first cavity is aligned with the first well.

Claims

1. A method for priming a chip, the method comprising:

providing an unprimed chip having a first configuration, the first configuration defining a selected channel of the chip that is to be primed;

selecting an adapter module from a plurality of adapter modules, the adapter module being compatible with substantially only the first configuration;

positioning the chip on a base plate, the base plate being arranged to accommodate at least the first configuration;

positioning the adapter module over the chip on the base plate;

securing the adapter module over the chip on the base plate; and

priming the chip by changing pressure in the chip via the adapter module, thereby filling the channel with a priming fluid and forcing air from the selected channel.

2. The method of claim 1 further comprising coupling the adapter module to a top plate, wherein positioning the adapter module over the chip on the base plate includes positioning the top plate over the base plate, and wherein securing the adapter module over the chip on the base plate includes coupling the top plate to the base plate.

3. The method of claim 2 further comprising coupling a pump to the top plate, wherein changing pressure in the chip through the adapter module includes changing pressure in the chip through the top plate using the pump.

4. The method of claim 3 wherein the pump is an automatic pump.

5. The method of claim 3 wherein the pump is a syringe including a plunger, and wherein changing pressure in the chip through the adapter module includes depressing the plunger.

6. The method of claim 5 wherein changing pressure in the chip through the adapter module further includes locking the plunger into place with respect to the top plate.

7. The method of claim 6 further comprising releasing the plunger from its locked condition.

8. The method of claim 1 wherein the chip includes a plurality of wells and a plurality of channels, the first configuration further defining a selected well, wherein the adapter module includes a plurality of cavities and a pressure port positioned within a selected cavity, and wherein positioning the adapter module over the chip comprises aligning the cavities with the wells such that the pressure port is aligned with a selected well.

9. The method of claim 1 wherein the chip includes a sipper, and wherein positioning the chip on the base plate includes passing the sipper through an opening defined within the base plate.

10. The method of claim 9 wherein priming the chip by changing pressure in the chip via the adapter module includes filling the sipper with a priming fluid and forcing air from the sipper.

11. The method of claim 1 wherein the chip includes a well in fluid communication with the selected channel, the method further comprising at least partially filling the well with the priming fluid prior to securing the adapter module over the chip on the base plate.

12. The method of claim 11 wherein the priming fluid is selected from the group consisting of a matrix mixture, a dye mixture, a marker mixture, and a combination thereof.