Priming module for microfluidic chips
First Claim
1. A method for priming a chip, the method comprising:
- providing an unprimed chip having a first configuration, the first configuration defining a selected channel of the chip that is to be primed;
selecting an adapter module from a plurality of adapter modules, the adapter module being compatible with substantially only the first configuration;
positioning the chip on a base plate, the base plate being arranged to accommodate at least the first configuration;
positioning the adapter module over the chip on the base plate;
securing the adapter module over the chip on the base plate; and
priming the chip by changing pressure in the chip via the adapter module, thereby filling the channel with a priming fluid and forcing air from the selected channel.
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Accused Products
Abstract
Methods and apparatuses for priming sample substrates such as DNA sipper chips are disclosed. According to one aspect of the present invention, a priming system that is suitable for priming a substrate which has a plurality of wells and at least one channel includes a base unit and a top unit. The base unit is arranged to accommodate, or support, the substrate. The top unit, which is substantially physically separate from the base unit, fits over the substrate when the substrate is held by the base unit. The top unit includes an adapter portion that interfaces with the substrate. Included in the adapter portion is a first cavity that is used to facilitate pressurizing a first well of the substrate when the adapter portion is interfaced with the substrate such that the first cavity is aligned with the first well.
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Citations
12 Claims
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1. A method for priming a chip, the method comprising:
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providing an unprimed chip having a first configuration, the first configuration defining a selected channel of the chip that is to be primed;
selecting an adapter module from a plurality of adapter modules, the adapter module being compatible with substantially only the first configuration;
positioning the chip on a base plate, the base plate being arranged to accommodate at least the first configuration;
positioning the adapter module over the chip on the base plate;
securing the adapter module over the chip on the base plate; and
priming the chip by changing pressure in the chip via the adapter module, thereby filling the channel with a priming fluid and forcing air from the selected channel. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification