Method of making microsensor
First Claim
1. A method of making a microsensor comprising the steps of:
- forming at least one cavity in the top surface of a substrate;
providing a device layer on top of the substrate extending over the cavity;
forming at least one reduced height region in a top surface of the device layer using a mask and etch module, wherein the mask and etch module etches material from the top surface of the device layer; and
forming one or more trenches in the device layer to form one or more components of a microsensor.
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Abstract
A linear accelerometer is provided having a support substrate, fixed electrodes having fixed capacitive plates, and a movable inertial mass having movable capacitive plates capacitively coupled to the fixed capacitive plates. Adjacent capacitive plates vary in height. The accelerometer further includes support tethers for supporting the inertial mass and allowing movement of the inertial mass upon experiencing a linear acceleration along a sensing axis. The accelerometer has inputs and an output for providing an output signal which varies as a function of the capacitive coupling and is indicative of both magnitude and direction of vertical acceleration along the sensing Z-axis. A microsensor fabrication process is also provided which employs a top side mask and etch module.
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Citations
19 Claims
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1. A method of making a microsensor comprising the steps of:
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forming at least one cavity in the top surface of a substrate;
providing a device layer on top of the substrate extending over the cavity;
forming at least one reduced height region in a top surface of the device layer using a mask and etch module, wherein the mask and etch module etches material from the top surface of the device layer; and
forming one or more trenches in the device layer to form one or more components of a microsensor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of making a microsensor comprising the steps of:
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forming at least one cavity in the top surface of a substrate;
providing a conductive device layer on top of the substrate extending over the cavity;
forming at least one reduced height region in a top surface of the device layer using a mask and etch module, wherein the mask and etch module etches material from the top surface of the device layer; and
forming trenches in the device layer that define a plurality of capacitive plates arranged to provide a capacitive coupling, wherein the capacitive coupling serves to sense acceleration. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19)
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Specification