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METHODS AND SYSTEMS FOR IMPROVING MICROELECTRONICI/O CURRENT CAPABILITIES

  • US 20060211167A1
  • Filed: 03/18/2005
  • Published: 09/21/2006
  • Est. Priority Date: 03/18/2005
  • Status: Abandoned Application
First Claim
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1. A semiconductor package assembly comprising a substrate, at least one integrated circuit chip mounted on said substrate, and at least one interconnect for connecting the substrate and said integrated circuit chip, and wherein the integrated circuit chip includes a via, the interconnect includes a solder ball extending into the via to help connect the circuit chip and the substrate, and the via has an increased diameter of about at least 55um to increase the electromigration lifetime of the solder ball.

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