Method for fabricating a wafer level package having through wafer vias for external package connectivity and related structure
First Claim
1. A method for fabricating a wafer level package, said method comprising:
- forming a polymer layer on a device wafer, said device wafer comprising at least one device wafer contact pad and at least one device, said at least one device wafer contact pad being electrically connected to said at least one device;
bonding a protective wafer to said device wafer;
forming at least one via in said protective wafer, said at least one via extending through said protective wafer;
wherein said at least one via is situated over said at least one device wafer contact pad.
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Abstract
According to an exemplary embodiment, a method for fabricating a wafer level package includes forming a polymer layer on a device wafer, where the device wafer includes at least one device wafer contact pad and a device, and where the at least one device wafer contact pad is electrically connected to the device. The method further includes bonding a protective wafer to the device wafer. The method further includes forming at least one via in the protective wafer, where the at least one via extends through the protective wafer and is situated over the at least one device wafer contact pad. The method further includes forming at least one protective wafer contact pad on the protective wafer, where the at least one protective wafer contact pad is situated over the at least one via and electrically connected to the at least one device wafer contact pad.
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Citations
20 Claims
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1. A method for fabricating a wafer level package, said method comprising:
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forming a polymer layer on a device wafer, said device wafer comprising at least one device wafer contact pad and at least one device, said at least one device wafer contact pad being electrically connected to said at least one device;
bonding a protective wafer to said device wafer;
forming at least one via in said protective wafer, said at least one via extending through said protective wafer;
wherein said at least one via is situated over said at least one device wafer contact pad. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A wafer level package comprising:
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a device wafer, said device wafer comprising at least one device wafer contact pad and at least one device, said at least one device wafer contact pad being electrically connected to said at least one device;
a polymer layer situated on said device wafer;
a protective wafer situated on said polymer layer, said protective wafer comprising at least one via, said at least one via extending through said protective wafer;
wherein said at least one via is situated over said at least one device wafer contact pad. - View Dependent Claims (13, 14, 15, 16, 18, 19, 20)
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12. The wafer level package of claim 111 wherein said polymer layer comprises at least one opening and a seal ring, wherein said at least one opening is situated over said at least one device wafer contact pad and said seal ring surrounds said at least one device.
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17. The wafer level package of claim 111 wherein said polymer layer comprises a photoimageable polymer.
Specification