Programmed material consolidation processes for fabricating electrical contacts and the resulting electrical contacts
First Claim
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1. A method for forming a contact for a semiconductor device component, comprising:
- fabricating a core of the contact by selectively consolidating material in accordance with a program; and
coating at least a portion of the core with at least one layer comprising conductive material.
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Abstract
An electrical contact for use with a semiconductor device, a carrier, a probe card, or another substrate includes a dielectric core, a conductive coating on at least a portion of the core, or both that are at least partially fabricated by a programmed material consolidation process, such as, but not limited to, stereolithography, in which unconsolidated material is selectively consolidated in accordance with a program. The electrical contact may be flexible and resilient or it may be rigid. Protective structures may accompany flexible, resilient contacts to prevent deformation thereof beyond their elastic limits.
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Citations
54 Claims
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1. A method for forming a contact for a semiconductor device component, comprising:
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fabricating a core of the contact by selectively consolidating material in accordance with a program; and
coating at least a portion of the core with at least one layer comprising conductive material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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- 16. A method for forming a contact for a semiconductor device component, comprising fabricating at least a portion of the contact by a programmed material consolidation process.
- 24. A contact of a semiconductor device component, comprising a plurality of at least partially superimposed, contiguous, mutually adhered layers.
- 34. A contact of a semiconductor device component, comprising a plurality of adjacent, mutually adhered regions.
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44. A contact for use with an electronic device component, comprising:
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a flexible, resilient core including a plurality of adjacent, mutually adhered layers; and
a conductive coating on the core. - View Dependent Claims (45)
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46. A method for protecting flexible, resilient contacts that protrude from at least one of surface of a substrate, comprising disposing a protective structure on the at least one surface laterally adjacent to each flexible, resilient contact that protrudes from the at least one surface, the protective structure:
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having a height which at least partially prevents an adjacent flexible, resilient contact from being deformed beyond its elastic limit;
orbeing spaced apart from the adjacent flexible, resilient contact a distance which at least partially prevents the adjacent flexible, resilient contact from being deformed beyond the elastic limit. - View Dependent Claims (47, 48, 49, 50, 51, 52, 53, 54)
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Specification