Semiconductor light source for illuminating a physical space including a 3-dimensional lead frame

• US 20060214179A1
• Filed: 04/04/2006
• Published: 09/28/2006
• Est. Priority Date: 08/24/2001
• Status: Active Grant

• Current Assignee: Satco Products Incorporated
• Original Assignee: CAO Group, Inc.
• Inventors: Cao, Densen
• Granted Patent: US 7,728,345 B2
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21V 3/02 characterised by the shape
• CPC Class Codes: F21Y 2107/30 on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements

Abstract

A semiconductor light source for illuminating physical spaces can include a lead frame with multiple facets. Each facet can have one or more semiconductor light emitting devices located on it.

Claims

1. A semiconductor light source for illuminating a physical space comprising:

a 3-dimensional lead frame,

said lead frame being made of a heat conductive material in order to draw heat away from semiconductor chips mounted to it,

a plurality of facets located on said lead frame, said facets being configured to accept mounting of light emitting semiconductor chips thereon, and

a plurality of light emitting semiconductor chips mounted on said facets.

2. A device as recited in claim 1 further comprising a cap on said lead frame serving as anode.

3. A device as recited in claim 2 further comprising a base on said lead frame serving as cathode.

4. A device as recited in claim 3 further comprising an insulation layer between anode and cathode.

5. A device as recited in claim 4 further comprising wires connecting said chips to anode and cathode.

6. A device as recited in claim 1 further comprising an epoxy cap covering lead frame and chips.

7. A device as recited in claim 6 wherein said epoxy cap serves to protect said lead frame and chips.

8. A device as recited in claim 7 wherein said epoxy cap serves as an optical lens for light emitted by said chips.

9. A device as recited in claim 7 wherein said epoxy cap serves to waterproof the light source.

10. A device as recited in claim 1 further comprising a light conversion layer for converting light emitted by the chips to white light.

11. A device as recited in claim 10 wherein said light conversion layer is a phosphor layer.

12. A device as recited in claim 1 wherein said lead fame has chips mounted on 2 facets.

13. A device as recited in claim 1 wherein said lead frame has chips mounted on 8 facets.

14. A device as recited in claim 1 wherein the light source emits light across an arc of 360 degrees.

15. A device as recited in claim 1 wherein the light source emits light across an arc of less than 360 degrees.

16. A device as recited in claim 1 wherein the light source emits light in one direction only.

17. A device as recited in claim 1 further comprising a threaded base for attachment to a light socket.

18. A semiconductor light source for illuminating a physical space comprising:

a first 3-dimensional lead frame,

a second 3-dimensional lead frame attached to said first 3-dimensional lead frame,

said lead frames being made of a heat conductive material in order to draw heat away from semiconductor chips mounted to them,

a plurality of facets located on said lead frames, said facets being configured to accept mounting of light emitting semiconductor chips thereon, and

a plurality of light emitting semiconductor chips mounted on said facets of said lead frames.

19. A device as recited in claim 18 wherein said lead frames are configured with respect to each other for form a bar light.

20. A device as recited in claim 19 further comprising an epoxy optical lens over said bar light.