Power semiconductor devices and methods of manufacture
6 Assignments
0 Petitions
Accused Products
Abstract
Various embodiments for improved power devices as well as their methods of manufacture, packaging and circuitry incorporating the same for use in a wide variety of power electronic applications are disclosed. One aspect of the invention combines a number of charge balancing techniques and other techniques for reducing parasitic capacitance to arrive at different embodiments for power devices with improved voltage performance, higher switching speed, and lower on-resistance. Another aspect of the invention provides improved termination structures for low, medium and high voltage devices. Improved methods of fabrication for power devices are provided according to other aspects of the invention. Improvements to specific processing steps, such as formation of trenches, formation of dielectric layers inside trenches, formation of mesa structures and processes for reducing substrate thickness, among others, are presented. According to another aspect of the invention, charge balanced power devices incorporate temperature and current sensing elements such as diodes on the same die. Other aspects of the invention improve equivalent series resistance (ESR) for power devices, incorporate additional circuitry on the same chip as the power device and provide improvements to the packaging of charge balanced power devices.
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Citations
245 Claims
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1-127. -127. (canceled)
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128. A semiconductor device comprising:
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a drift region of a first conductivity type;
a well region extending above the drift region and having a second conductivity type opposite the first conductivity type;
an active trench extending through the well region and into the drift region, the active trench having its sidewalls and bottom lined with dielectric material, and substantially filled with a first conductive layer and a first gate conductive layer, the first conductive layer being disposed below the first gate conductive layer and separated therefrom by inter-electrode dielectric material;
source regions having the first conductivity type formed in the well region adjacent the active trench; and
a first Schottky structure formed on a first mesa between two adjacent trenches. - View Dependent Claims (129, 130, 131, 132, 133, 134)
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135-235. -235. (canceled)
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236. A semiconductor device comprising:
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a drift region of a first conductivity type;
a well region extending above the drift region and having a second conductivity type opposite the first conductivity type;
a plurality of trenches extending through the well region and into the drift region, each of the plurality of trenches having its sidewalls and bottom lined with dielectric material, and substantially filled with a first conductive layer and a second conductive layer, the second conductive layer being disposed below the first conductive layer and separated therefrom by inter-electrode dielectric material;
source regions having the first conductivity type formed in the well region adjacent a trench; and
a first Schottky structure formed on a first mesa between two adjacent trenches of the plurality of trenches. - View Dependent Claims (237, 238, 239, 240, 241, 242, 243, 244, 245)
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Specification