Device and method for manufacturing the same

• US 20060214267A1
• Filed: 05/12/2006
• Published: 09/28/2006
• Est. Priority Date: 11/28/2003
• Status: Active Grant

• Current Assignee: Sensotherm Temperatursensorik GmbH (TE Connectivity Ltd. (United Kingdom))
• Original Assignee: Georg Bernitz
• Inventors: Bernitz, Georg
• Granted Patent: US 7,537,963 B2
• Time in Patent Office: Days
• US Class Current: 257/620
• CPC Class Codes: G01K 7/16 using resistive elements resistive elements per se H01C, H01L
• CPC Class Codes: H01C 1/142 the terminals or tapping points being coated on the resistive element
• CPC Class Codes: H01C 17/006 adapted for manufacturing resistor chips
• CPC Class Codes: H01C 17/281 by thick film techniques
• CPC Class Codes: H01C 7/001 Mass resistors
• CPC Class Codes: H01G 13/006 Apparatus or processes for applying terminals
• CPC Class Codes: H01G 4/224 Housing; Encapsulation
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

In a method for manufacturing a device, at first a plurality of components each having at least a first terminal region are provided. Furthermore, a support with a first surface, in which a plurality of recesses are formed, is provided. The components provided are inserted into the recesses such that the first terminal region of each component faces the first surface of the support. Conductive material is applied on the first surface of the support such that the conductive material is in contact with the first terminal region of each component. Finally, the support is diced to obtain the individual devices.

Claims

1. A method for manufacturing devices, comprising the steps of:

providing a plurality of components each having at least a first terminal region;

providing a support having a first surface, in which a plurality of recesses are formed;

inserting the components provided into the recesses such that the first terminal region of each component faces the first surface of the support;

applying a conductive material on the first surface of the support such that the conductive material is in contact with the first terminal region of each component; and

dicing the support to obtain the individual devices.

2. The method of claim 1, wherein

the components have a first terminal region and a second terminal region;

the recesses in the support extend from the first surface to a second surface opposing the first surface; and

the components are inserted in the recesses such that the first terminal region faces the first surface and the second terminal region faces the second surface;

wherein the method further comprises the step of;

applying a conductive material on the second surface of the support such that the conductive material is in contact with the second terminal region of each component.

3. The method of claim 1, comprising the step of:

burning-in the conductive material.

4. The method of claim 1, further comprising the step of:

generating the plurality of devices from the support with the components arranged therein, such that a dimension of each device is greater than that of the inserted component, and a terminal region of the device is greater than the terminal region of the component.

5. The method of claim 4, wherein dicing the support includes splitting the support or punching the support.

6. The method of claim 1, wherein the recess in the support is generated by mechanical or chemical treatment.

7. The method of claim 1, wherein the support includes non-conductive material selected from the group including glass, ceramics, unburned ceramic material, epoxy, or polyimide, or including conductive material with a non-conductive surface.

8. The method of claim 1, wherein the conductive material includes platinum gold, silver, nickel or conductive glue.

9. The method of claim 1, wherein the component provided includes a temperature sensor.

10. A device manufactured according to the method for manufacturing devices, comprising the steps of:

providing a plurality of components each having at least a first terminal region;

providing a support having a first surface, in which a plurality of recesses are formed;

inserting the components provided into the recesses such that the first terminal region of each component faces the first surface of the support;

applying a conductive material on the first surface of the support such that the conductive material is in contact with the first terminal region of each component; and

dicing the support to obtain the individual devices,

the device comprising;

a support having a first surface, in which a recess is arranged;

a component having a first terminal region, which is arranged in the recess, such that the first terminal region faces the first surface; and

a conductive layer on the first surface of the support, which is in contact with the first terminal region of the component.

11. The device of claim 10, wherein

the component has a second terminal region;

the recess extends from the first surface of the support to a second surface of the support opposing the first surface; and

a conductive layer on the second surface of the support, which is in contact with the second terminal region of the component.

12. The device of claim 11, wherein the support includes non-conductive material selected from the group including glass, ceramics, unburned ceramic material, epoxy, or polyimide, or including conductive material with a non-conductive surface.

13. The device of claim 10, wherein the conductive material includes platinum, gold, silver, nickel or conductive glue.

14. The device of claim 10, wherein the component includes a temperature sensor.