Monolithic integrated circuit/pressure sensor on pacing lead

• US 20060219019A1
• Filed: 03/31/2005
• Published: 10/05/2006
• Est. Priority Date: 03/31/2005
• Status: Active Grant

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Schugt, Michael A.
• Granted Patent: US 7,231,829 B2
• Time in Patent Office: Days
• US Class Current: 73/729.200
• CPC Class Codes: A61B 2562/0247 Pressure sensors
• CPC Class Codes: A61B 2562/168 Fluid filled sensor housings
• CPC Class Codes: A61B 2562/187 Strain relief means
• CPC Class Codes: A61B 5/0215 by means inserted into the body catheters A61M25/00
• CPC Class Codes: A61B 5/03 Detecting, measuring or recording fluid pressure within the body other than blood pressure, e.g. cerebral pressure; Measuring pressure in body tissues or organs A61B5/205 takes precedence
• CPC Class Codes: G01L 9/0082 Transmitting or indicating the displacement of capsules by electric, electromechanical, magnetic, or electromechanical means G01L9/0008 takes precedence
• CPC Class Codes: Y10T 29/435 Solid dielectric type
• CPC Class Codes: Y10T 29/49005 Acoustic transducer
• CPC Class Codes: Y10T 29/49007 Indicating transducer

Abstract

A pressure module is provided which comprises a capsule having a cavity formed therein, and a pressure transducer disposed within the cavity of the capsule. A feedthrough pin, fixedly coupled to the capsule, extends into the capsule and is electronically coupled to the pressure transducer.

Claims

1. A pressure sensor module, incorporated with a medical lead, the module comprising:

a capsule having a cavity formed therein;

a pressure transducer disposed within said cavity of said capsule; and

a feedthrough pin extending into said capsule and fixedly coupled thereto, said feedthrough pin electrically coupled to said pressure transducer.

2. The pressure sensor module of claim 1, further comprising:

a flexible conductor coupled between said feedthrough pin and said pressure transducer.

3. The pressure sensor module of claim 1, wherein said pressure transducer is suspended within said cavity of said capsule.

4. The pressure sensor module of claim 3, further comprising:

biocompatible media disposed within said cavity and surrounding said pressure transducer.

5. The pressure sensor module of claim 1, wherein said pressure transducer includes a passivating layer disposed thereon.

6. The pressure sensor module of claim 1 further comprising an insulative ferrule fixedly coupled in a wall of said capsule to insulate said feedthrough pin from said capsule.

7. The pressure sensor module of claim 1, further comprising:

an outer housing disposed around said capsule, said outer housing including an opening therethrough in fluid communication with said cavity.

8. The pressure sensor module of claim 7, further comprising:

a resilient diaphragm disposed over at least said opening for transmitting a pressure applied thereto.

9. The pressure sensor module of claim 7, further comprising:

a flexible outer sheath around said outer housing, said outer sheath having a section disposed over said opening and responsive to pressure applied to said section.

10. A pressure sensor module for use in a medical lead having a wire conductor, comprising:

a capsule having a cavity formed therein;

biocompatible media disposed within said cavity of said capsule;

a pressure transducer disposed within said biocompatible media; and

a feedthrough pin fixedly coupled to said capsule, said feedthrough pin having a first end configured to be coupled to the wire conductor and said second end flexibly coupled to said pressure transducer.

11. The pressure sensor module of claim 10, further comprising:

a flexible conductor coupled between said second end of said feedthrough pin and said pressure transducer.

12. The pressure sensor module of claim 10, wherein said pressure transducer includes a passivating layer disposed thereon.

13. The pressure sensor module of claim 10 further comprising:

an insulative ferrule fixedly coupled in a wall of said capsule to insulate said feedthrough pin from said capsule.

14. The pressure sensor module of claim 13 further comprising:

an outer housing disposed around said capsule, said outer housing including an opening therethrough in fluid communication with said cavity.

15. The pressure sensor module of claim 14 further comprising:

a flexible diaphragm disposed over at least said opening for transmitting a pressure applied thereto.

16. The pressure sensor module of claim 14 further comprising:

a flexible outer sheath around said outer housing, said outer sheath having a section disposed over said opening and responsive to pressure applied to said section.

17. A method for manufacturing a pressure sensor module comprising:

flexibly mounting a transducer in a cavity of a capsule; and

bonding a conductor between the pressure transducer and a feedthrough pin fixedly coupled to the capsule.

18. The method of claim 17, further comprising:

depositing a biocompatible media into the cavity of the capsule.

19. The method of claim 18, wherein the step of mounting comprises positioning the pressure transducer in the biocompatible media.

20. The method of claim 17, wherein the step of mounting comprises:

insulating said feedthrough pin from said capsule by means of an insulating ferrule through a wall of said capsule; and

heating the insulative ferrule, feedthrough pin, and capsule to fixedly couple the feedthrough pin to the insulative ferrule and the insulative ferrule to the capsule.