Pressure sensor system

• US 20060219022A1
• Filed: 09/30/2005
• Published: 10/05/2006
• Est. Priority Date: 10/01/2004
• Status: Active Grant

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Ohta, Hiroyuki, Sumigawa, Takashi
• Granted Patent: US 7,252,010 B2
• Time in Patent Office: Days
• US Class Current: 73/754
• CPC Class Codes: G01L 9/0055 bonded on a diaphragm

Abstract

In order to realize a compact wireless pressure sensor system which transmits an accurate pressure value, the present invention provides a pressure sensor system constructed at least by a silicon chip on which a circuit operated by electromagnetic wave energy is mounted, and a film which supports an antenna, in which film a through-hole is provided in the vicinity of a diaphragm part.

Claims

1. A pressure sensor system, comprising:

a semiconductor chip comprising a pressure sensor and a transmit control part to which a signal based on a measurement value of the pressure sensor is inputted; and

an antenna member to which said semiconductor chip is fixed, the antenna member comprising an antenna electrically connected to the transmit control part, wherein

said antenna member comprises a notched part in an area which overlaps said semiconductor chip.

2. The pressure sensor system according to claim 1, wherein the pressure sensor is located in the area where the notched part is formed.

3. The pressure sensor system according to claim 1, further comprising a plurality of said antenna members, wherein said semiconductor chip is fixed to the plurality of antenna members.

4. The pressure sensor system according to claim 1, wherein said semiconductor chip is disposed in the area of the notched part of the substrate.

6. The pressure sensor system according to claim 1, wherein said antenna member is provided with a high magnetic permeability layer having higher magnetic permeability than a peripheral member thereof.

7. The pressure sensor system according to claim 4, wherein the substrate comprises a high magnetic permeability layer with the notched part, and said semiconductor chip is disposed in an area where the notched part is formed.

8. A pressure measurement receiving device, comprising a receiving part which receives a signal from the pressure sensor system according to claim 1 installed in an object to be measured, and a recording part which records the received signal.

9. A pressure measuring container comprising a container capable of accommodating liquid or gas therein, and said pressure sensor system according to claim 1 disposed in the container, wherein a surface of said semiconductor chip, on which surface the transmit and reception control circuit is formed, is disposed so as to be opposed to an inner wall of the container.

10. A pressure measuring container comprising a container capable of accommodating liquid or gas therein, and said pressure sensor system according to claim 1 disposed in the container, wherein a back surface of a surface of said semiconductor chip on which the transmit and reception control circuit is formed is disposed so as to be opposed to an inner wall of the container.

5. A pressure sensor system, comprising:

a semiconductor chip comprising a pressure sensor and a transmit control part to which a signal based on a measurement value of the pressure sensor is inputted; and

an antenna member to which said semiconductor chip is fixed, the antenna member comprising an antenna electrically connected to the transmit control part, wherein

the pressure sensor system is formed so that a surface of said semiconductor chip on an opposite side to a surface on which the transmit control circuit is formed is supported by said antenna member.