Double-sided wiring board fabrication method, double-sided wiring board, and base material therefor

• US 20060219428A1
• Filed: 10/21/2005
• Published: 10/05/2006
• Est. Priority Date: 03/29/2005
• Status: Active Grant

• Current Assignee: Hitachi Cable Limited (Proterial Ltd.)
• Original Assignee: Hitachi Cable Limited (Proterial Ltd.)
• Inventors: Chinda, AKira, Miyamoto, Nobuaki
• Granted Patent: US 7,681,310 B2
• Time in Patent Office: Days
• US Class Current: 174/257
• CPC Class Codes: H05K 2201/0352 Differences between the conductors of different layers of a multilayer
• CPC Class Codes: H05K 2201/0394 Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
• CPC Class Codes: H05K 3/0035 of blind holes, i.e. having a metal layer at the bottom
• CPC Class Codes: H05K 3/0038 combined with laser drilling through a metal layer
• CPC Class Codes: H05K 3/025 by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
• CPC Class Codes: H05K 3/421 Blind plated via connections H05K3/422, H05K3/423 and H05K3/425 take precedence
• CPC Class Codes: H05K 3/427 initial plating of through-holes in metal-clad substrates
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base

Abstract

A method is provided for fabricating a double-sided wiring board for mounting an electronic component thereon having metal wiring patterns formed both on upper and lower sides of an electrically-insulating board. The metal wiring patterns are electrically connected each other through a through-hole and/or a blind via-hole. The method has the steps of: laminating a metal layer with a support substrate on at least one side of the electrically-insulating board; removing the support substrate from the metal layer so that the metal layer is left on the electrically-insulating board; and forming the through-hole and/or the blind via-hole in the electrically-insulating board.

Claims

1. A method for fabricating a double-sided wiring board for mounting an electronic component thereon comprising metal wiring patterns formed both on upper and lower sides of an electrically-insulating board, the metal wiring patterns being electrically connected each other through a through-hole and/or a blind via-hole, comprising the steps of:

laminating a metal layer with a support substrate on at least one side of the electrically-insulating board;

removing the support substrate from the metal layer so that the metal layer is left on the electrically-insulating board; and

forming the through-hole and/or the blind via-hole in the electrically-insulating board.

3. The method for fabricating a double-sided wiring board according to claim 1, wherein:

the metal layer comprises a copper or copper alloy foil, a stainless foil, an aluminum or aluminum alloy foil, a nickel or nickel alloy foil, or a tin or tin alloy foil.

5. The method for fabricating a double-sided wiring board according to claim 1, wherein:

the metal layer with the support substrate comprises a carrier layer of a metal material, a release layer formed on the carrier layer, and a metal layer formed on the release layer, and

the metal layer is bonded to the electrically-insulating board.

7. The method for fabricating a double-sided wiring board according to claim 5, wherein:

the metal layer has a bond strength between the metal layer and the carrier layer via the release layer smaller than between the metal layer and the electrically-insulating board.

9. The method for fabricating a double-sided wiring board according to claim 1, wherein:

the metal layer has a thickness of 1 μ

m or greater and 8 μ

m or less.

11. The method for fabricating a double-sided wiring board according to claim 5, wherein:

the metal layer has a thickness smaller than the carrier layer.

13. The method for fabricating a double-sidedwiring board according to claim 1, wherein:

the electrical connection through the through-hole or the blind via-hole is made by electrolyticplating and/or electroless plating on a wall of the through-hole or the blind via-hole.

2. A method for fabricating a double-sided wiring board for mounting an electronic component thereon comprising metal wiring patterns formed both on upper and lower sides of an electrically-insulating board, the metal wiring patterns being electrically connected each other through a through-hole and/or a blind via-hole, comprising the steps of:

laminating a metal layer with a support substrate on at least one side of the electrically-insulating board;

forming the through-holes and/or the blind via-holes in the electrically-insulating board; and

removing the support substrate from the metal layer so that the metal layer is left on the electrically-insulating board.

4. The method for fabricating a double-sided wiring board according to claim 2, wherein:

the metal layer comprises a copper or copper alloy foil, a stainless foil, an aluminum or aluminum alloy foil, a nickel or nickel alloy foil, or a tin or tin alloy foil.

6. The method for fabricating a double-sided wiring board according to claim 2, wherein:

the metal layer with the support substrate comprises a carrier layer of a metal material, a release layer formed on the carrier layer, and a metal layer formed on the release layer, and

the metal layer is bonded to the electrically-insulating board.

8. The method for fabricating a double-sided wiring board according to claim 6, wherein:

the metal layer has a bond strength between the metal layer and the carrier layer via the release layer smaller than between the metal layer and the electrically-insulating board.

10. The method for fabricating a double-sided wiring board according to claim 2, wherein:

the metal layer has a thickness of 1 μ

m or greater and 8 μ

m or less.

12. The method for fabricating a double-sided wiring board according to claim 6, wherein:

the metal layer has a thickness smaller than the carrier layer.

14. The method for fabricating a double-sided wiring board according to claim 2, wherein:

the electrical connection through the through-hole or the blind via-hole is made by electrolyticplating and/or electroless plating on a wall of the through-hole or the blind via-hole.

15. A method for fabricating a double-sided wiring board for mounting electronic components thereon comprising metal wiring patterns formed both on upper and lower sides of an electrically-insulating board, the metal patterns being electrically connected each other through a blind via-hole, comprising the steps of:

laminating a metal layer with a support substrate on both sides of the electrically-insulating board;

removing the support substrate located on an open side of the blind via-hole and subsequently forming the blind via-hole in the electrically-insulating board, or forming the blind via-hole in the electrically-insulating board and subsequently removing the support substrate located on the open side of the blind via-holes; and

making the electrical connection on a wall of the blind via-hole and subsequently removing the support substrate located on opposite the open side of the blind via-hole.

16. A double-sidedwiring board for mounting an electronic component, comprising:

an electrically-insulating board;

metal wiring patterns formed both on upper and lower sides of the electrically-insulating board; and

a through-hole and/or a blind via-hole formed in the electrically-insulating board for allowing electrical conduction between the metal wiring patterns therethrough, wherein;

the metal wiring patterns comprising a first metal layer,

the through-hole and/or a blind via-hole comprises a second metal layer formed on a wall thereof, and

the first metal layer comprises a thickness 1 to 8 μ

m greater than the second metal layer.

17. The double-sided wiring board for mounting an electronic component according to claim 16, wherein:

the first metal layer and the second metal layer comprise a copper or copper alloy foil, a stainless foil, an aluminum or aluminum alloy foil, a nickel or nickel alloy foil, or a tin or tin alloy foil.

18. A base material for fabricating a double-sided wiring board for mounting an electronic component, comprising:

an electrically-insulating board;

metal wiring patterns formed both on upper and lower sides of the electrically-insulating board; and

a through-hole and/or a blind via-hole formed in the electrically-insulating board for allowing electrical conduction between the metal wiring patterns therethrough, wherein;

a metal layer with a support substrate is laminated on at least one side of the electrically-insulating board.