Semiconductor light emitting device and semiconductor light emitting unit

• US 20060220048A1
• Filed: 03/28/2006
• Published: 10/05/2006
• Est. Priority Date: 03/30/2005
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Tonedachi, Tatsuo, Matsumoto, Iwao
• Granted Patent: US 7,557,384 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

In various aspects, a semiconductor light emitting device may include a mold resin having a cup shape portion on an upper surface of the mold resin; a first lead provided in the mold resin and extending from the cup shape portion to outside of the mold resin, the first lead having a first lead section and a second lead section, the second lead section of the first lead being thicker than the first lead section of the first lead, the second lead section of the first lead having a hole; a second lead provided in the mold resin and extending from the cup shape portion to outside of the mold resin, having a first lead section and a second lead section, the second lead section of the second lead being thicker than the first lead section of the second lead; a light emitting element mounted on the second section of the first lead in the cup shape portion; a wire electrically connecting the light emitting element and the second lead; and a sealing resin configured to seal the light emitting element and the wire.

Claims

1. A semiconductor light emitting device, comprising:

a mold resin having a cup shape portion on an upper surface of the mold resin;

a first lead provided in the mold resin and extending from the cup shape portion to outside of the mold resin, the first lead having a first lead section and a second lead section, the second lead section of the first lead being thicker than the first lead section of the first lead, the second lead section of the first lead having a hole;

a second lead provided in the mold resin and extending from the cup shape portion to outside of the mold resin, having a first lead section and a second lead section, the second lead section of the second lead being thicker than the first lead section of the second lead;

a light emitting element mounted on the second section of the first lead in the cup shape portion;

a wire electrically connecting the light emitting element and the second lead; and

a sealing resin configured to seal the light emitting element and the wire.

2. A semiconductor light emitting device of claim 1, wherein a female screw is provided on an inner surface of the hole.

3. A semiconductor light emitting device of claim 1, wherein the hole is provided in a part of the second section of the first lead and the mold resin is not provided on the part.

4. A semiconductor light emitting device of claim 1, wherein a bottom surface of the second section of the first lead is exposed from the mold resin.

5. A semiconductor light emitting device of claim 4, wherein a bottom surface of the first lead and the second lead are provided on a substantially same plane.

6. A semiconductor light emitting device of claim 1, wherein a third section of the first lead is provided in the second section of first lead, and is thicker than the first section of the first lead and thinner than the second section of the first lead, and the light emitting element is mounted on the third section of the first lead.

7. A semiconductor light emitting device of claim 1, wherein a contact area between the second lead and the mold resin is larger than a contact area between the first lead and the mold resin, and the second lead has a hole embedded by the mold resin.

8. A semiconductor light emitting device of claim 7, wherein the hole in the second lead is provided in a boundary between a part covered with the mold resin and a part not covered with the mold resin.

9. A semiconductor light emitting unit, comprising:

a substrate having an opening on an upper surface of the substrate and a conductive pattern on the upper surface of the substrate;

a semiconductor light emitting device provided on the substrate, the semiconductor light emitting device including,

a mold resin having a cup shape portion on an upper surface of the mold resin;

a first lead provided in the mold resin and extending from the cup shape portion to outside of the mold resin, the first lead having a first lead section and a second lead section, the second lead section of the first lead being thicker than the first lead section of the first lead, the second lead section of the first lead having a hole;

a second lead provided in the mold resin and extending from the cup shape portion to outside of the mold resin, having a first lead section and a second lead section, the second lead section of the second lead being thicker than the first lead section of the second lead;

a light emitting element mounted on the second section of the first lead in the cup shape portion;

a wire electrically connecting the light emitting element and the second lead;

a sealing resin configured to seal the light emitting element and the wire;

a board provided having a protrusion, the protrusion being provided in the opening of the substrate and in contact with the second section of the first lead; and

a fixing member provided in the hole of the second section of the first lead and a part of the board.

10. A semiconductor light emitting unit of claim 9, wherein said board is a metal board.

11. A semiconductor light emitting unit of claim 9, wherein a female screw is provided on an inner surface of the hole.

12. A semiconductor light emitting unit of claim 9, wherein the hole is provided in a part of the second section of the first lead and the mold resin is not provided on the part.

13. A semiconductor light emitting unit of claim 9, wherein a bottom surface of the second section of the first lead is exposed from the mold resin.

14. A semiconductor light emitting device of claim 13, wherein a bottom surface of the first lead and the second lead are provided on a substantially same plane.

15. A semiconductor light emitting device, comprising:

a mold resin having a cup shape portion on an upper surface of the mold resin;

a first lead provided in the mold resin and extending from the cup shape portion to outside of the mold resin, the first lead having a first lead section and a second lead section, the second lead section of the first lead being thicker than the first lead section of the first lead;

a second lead provided in the mold resin and extending from the cup shape portion to outside of the mold resin, having a first lead section and a second lead section, the second lead section of the second lead being thicker than the first lead section of the second lead;

a light emitting element mounted on the second section of the first lead in the cup shape portion;

a wire electrically connecting the light emitting element and the second lead;

a sealing resin configured to seal the light emitting element and the wire; and

means for fixing the second section of the first lead to a part outside of the semiconductor light emitting device.

16. A semiconductor light emitting device of claim 15, wherein the hole is provided in a part of the second section of the first lead and the mold resin is not provided on the part.

17. A semiconductor light emitting device of claim 15, wherein a bottom surface of the second section of the first lead is exposed from the mold resin.

18. A semiconductor light emitting device of claim 17, wherein a bottom surface of the first lead and the second lead are provided on a substantially same plane.

19. A semiconductor light emitting device of claim 15, wherein a third section of the first lead is provided in the second section of first lead, and is thicker than the first section of the first lead and thinner than the second section of the first lead, and the light emitting element is mounted on the third section of the first lead.

20. A semiconductor light emitting device of claim 15, wherein said means for fixing includes by screwing one of said first lead relative to said part.

21. A semiconductor light emitting device of claim 15, wherein said means for fixing includes by engaging one of said first lead relative to said part.

22. A semiconductor light emitting device of claim 15, wherein said means for fixing includes by fitting one of said first lead relative to said part.