Structure of a structure release and a method for manufacturing the same
First Claim
1. A device suitable for an optical interference display cell structure, the device comprising:
- a first electrode;
a second electrode including at least one hole, wherein the second electrode is arranged about parallel with the first electrode; and
a supporter located between the first electrode and the second electrode, wherein a cavity is formed between the supporter, the first electrode and the second electrode, wherein when a structure release etching process is used to remove a sacrificial layer between the first electrode and the second electrode to form the cavity, an etchant passes through the hole to etch the sacrificial layer, so as to reduce the time needed in the structure release etching process.
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Accused Products
Abstract
A structure of a structure release and a manufacturing method are provided. The structure and manufacturing method are adapted for an interference display cell. The structure of the interference display cell includes a first electrode, a second electrode and at least one supporter. The second electrode has at least one hole and is arranged about parallel with the first electrode. The supporter is located between the first electrode and the second electrode and a cavity is formed. In the release etch process of manufacturing the structure, an etchant can pass through the hole to etch a sacrificial layer between the first and the second electrodes to form the cavity; therefore, the time needed for the process becomes shorter.
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Citations
17 Claims
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1. A device suitable for an optical interference display cell structure, the device comprising:
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a first electrode;
a second electrode including at least one hole, wherein the second electrode is arranged about parallel with the first electrode; and
a supporter located between the first electrode and the second electrode, wherein a cavity is formed between the supporter, the first electrode and the second electrode, wherein when a structure release etching process is used to remove a sacrificial layer between the first electrode and the second electrode to form the cavity, an etchant passes through the hole to etch the sacrificial layer, so as to reduce the time needed in the structure release etching process. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method for manufacturing an optical interference display device disposed on a substrate, the method comprising:
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forming a first electrode on the substrate;
forming a sacrificial layer on the first electrode;
forming at least two openings in the sacrificial layer and the first electrode to define a position of the optical interference display device;
forming a supporter in each of the openings;
forming a second electrode on the sacrificial layer and the supporter in each of the openings, wherein the second electrode includes at least one hole, and the hole exposes the sacrificial layer; and
removing the sacrificial layer by a remote plasma etching process. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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Specification