Circuit device and manufacturing method thereof
First Claim
1. A circuit device in which a functional device and an externally leading conductor are mounted, comprising:
- a substrate;
a wiring layer provided on the substrate and electrically connected to the functional device and to the externally leading conductor; and
a coating metal layer formed on a part of the wiring layer to provide a coated region in which the wiring layer is coated and an exposing region in which the wiring layer is exposed;
wherein the functional device is connected onto the coating metal layer within the coated region, and the externally leading conductor is bonded to a part of the wiring layer within the exposing region.
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Accused Products
Abstract
A circuit device includes a ceramic substrate, an Al wiring layer provided on the ceramic substrate, and a semiconductor device and a bus bar which are electrically connected to the wiring layer. On part of the wiring layer, a Ni layer is plated. Thus a coated region in which the wiring layer is coated with nickel having solder wetability superior to aluminum and an exposing region in which the wiring layer is exposed as viewed from above the ceramic substrate are provided. The semiconductor device is connected onto the Ni layer within the coated region through solder. The bus bar is ultrasonically bonded to the wiring layer within the exposing region as viewed from above the ceramic substrate. Thus, the circuit device including the semiconductor device and the bus bar that are bonded to the ceramic substrate by sufficient bonding strength and its manufacturing method are provided.
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Citations
12 Claims
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1. A circuit device in which a functional device and an externally leading conductor are mounted, comprising:
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a substrate;
a wiring layer provided on the substrate and electrically connected to the functional device and to the externally leading conductor; and
a coating metal layer formed on a part of the wiring layer to provide a coated region in which the wiring layer is coated and an exposing region in which the wiring layer is exposed;
wherein the functional device is connected onto the coating metal layer within the coated region, and the externally leading conductor is bonded to a part of the wiring layer within the exposing region. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method of manufacturing a circuit device in which a functional device and an externally leading conductor are mounted, the method comprising the steps of:
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partially forming a coating metal layer onto a wiring layer formed on a substrate, thereby providing a coated region in which the wiring layer is coated and an exposing region in which the wiring layer is exposed;
connecting the functional device onto the coating metal layer within the coated region; and
bonding the externally leading conductor to a portion of the wiring layer within the exposing region. - View Dependent Claims (8, 9, 10, 11, 12)
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Specification