Semiconductor device with power module housed in casing

• US 20060220236A1
• Filed: 03/09/2006
• Published: 10/05/2006
• Est. Priority Date: 03/17/2005
• Status: Active Grant

• Current Assignee: Kyoho Machine Works Limited (Toyota Motor Corporation), Toyota Jidosha Kabushiki Kaisha (Toyota Motor Corporation)
• Original Assignee: Kyoho Machine Works Limited (Toyota Motor Corporation), Toyota Jidosha Kabushiki Kaisha (Toyota Motor Corporation)
• Inventors: Menjo, Takeshi, Kikuchi, Takaji
• Granted Patent: US 7,455,553 B2
• Time in Patent Office: Days
• US Class Current: 257/727
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/1432 specially adapted for power drive units or power converters
• CPC Class Codes: H05K 7/14329 specially adapted for the configuration of power bus bars

Abstract

An electrically insulating member is provided between a bus bar of an IPM and a nearby casing so as to electrically insulate the casing from the bus bar of the IPM. Above the portion where electrical insulation is necessary, a bracket provided for supporting a component-to-be supported is secured to the casing. The electrically insulating member is attached to a lower portion of the bracket that is an existing component.

Claims

1. A semiconductor device comprising:

an electrically conductive casing;

a power module portion housed in said casing and having at least one electrically non-insulating portion located near said casing;

a component fixedly provided in the vicinity of said electrically non-insulating portion and within said casing and having a predetermined capability; and

an electrically insulating member provided between said electrically non-insulating portion of said power module portion and said casing and attached to said component.

2. The semiconductor device according to claim 1, wherein

said electrically insulating member includes:

a support member attached to said component; and

electrically insulating paper wrapped around said support member.

3. The semiconductor device according to claim 1, wherein

said electrically insulating member is made of a resin having electrical insulation property.

4. A semiconductor device comprising:

an electrically conductive casing;

a power module portion housed in said casing and having at least one electrically non-insulating portion located near said casing; and

a component fixedly provided in the vicinity of said electrically non-insulating portion and within said casing and having a predetermined capability, wherein

said component includes;

an essential-capability portion having said predetermined capability; and

an electrical-insulation-capability portion connected to said essential-capability portion, and

said electrical-insulation-capability portion is formed to be provided between said electrically non-insulating portion of said power module portion and said casing.

5. The semiconductor device according to claim 4, wherein

said electrical-insulation-capability portion includes:

a support portion integrally molded with said essential-capability portion; and

electrically insulating paper wrapped around said support portion.

6. The semiconductor device according to claim 4, wherein

said electrical-insulation-capability portion is made of a resin integrally molded with said essential-capability portion and having electrical insulation property.