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MULTI-CHIP STRUCTURE AND METHOD OF ASSEMBLING CHIPS

  • US 20060220259A1
  • Filed: 01/24/2006
  • Published: 10/05/2006
  • Est. Priority Date: 01/25/2005
  • Status: Active Grant
First Claim
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1. A multi-chip structure comprising:

  • a first chip;

    a second chip;

    at least a conductive pillar on the first chip;

    a conductive connecting material connecting said conductive pillar to said second chip;

    an underfill material filling a gap between said first chip and said second chip; and

    at least one embankment structure disposed on said second chip for protecting a wire-bonding pad of said second chip from being contaminated by said underfill material.

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