H01L 2224/05647 :
Copper [Cu] as principal co...
H01L 2224/05655 :
Nickel [Ni] as principal co...
H01L 2224/05666 :
Titanium [Ti] as principal ...
H01L 2224/05684 :
Tungsten [W] as principal c...
H01L 2224/13099 :
Material
H01L 2224/13109 :
Indium [In] as principal co...
H01L 2224/13111 :
Tin [Sn] as principal const...
H01L 2224/13113 :
Bismuth [Bi] as principal c...
H01L 2224/13116 :
Lead [Pb] as principal cons...
H01L 2224/13118 :
Zinc [Zn] as principal cons...
H01L 2224/1312 :
Antimony [Sb] as principal ...
H01L 2224/13123 :
Magnesium [Mg] as principal...
H01L 2224/13139 :
Silver [Ag] as principal co...
H01L 2224/13144 :
Gold [Au] as principal cons...
H01L 2224/13147 :
Copper [Cu] as principal co...
H01L 2224/13166 :
Titanium [Ti] as principal ...
H01L 2224/13184 :
Tungsten [W] as principal c...
H01L 2224/16145 :
the bodies being stacked
H01L 2224/16225 :
the item being non-metallic...
H01L 2224/26145 :
Flow barriers
H01L 2224/26175 :
Flow barriers
H01L 2224/27013 :
for holding or confining th...
H01L 2224/29099 :
Material
H01L 2224/29109 :
Indium [In] as principal co...
H01L 2224/29111 :
Tin [Sn] as principal const...
H01L 2224/32145 :
the bodies being stacked
H01L 2224/32225 :
the item being non-metallic...
H01L 2224/32245 :
the item being metallic
H01L 2224/45144 :
Gold (Au) as principal cons...
H01L 2224/48091 :
Arched
H01L 2224/48227 :
connecting the wire to a bo...
H01L 2224/48247 :
connecting the wire to a bo...
H01L 2224/73203 :
Bump and layer connectors
H01L 2224/73204 :
the bump connector being em...
H01L 2224/73265 :
Layer and wire connectors
H01L 2224/81193 :
wherein the bump connectors...
H01L 2224/83051 :
Forming additional members,...
H01L 2224/83365 :
Shape, e.g. interlocking fe...
H01L 2225/0651 :
Wire or wire-like electrica...
H01L 2225/06513 :
Bump or bump-like direct el...
H01L 2225/06517 :
Bump or bump-like direct el...
H01L 2225/06527 :
Special adaptation of elect...
H01L 2225/06555 :
Geometry of the stack, e.g....
H01L 2225/06582 :
Housing for the assembly, e...
H01L 23/3128 :
the substrate having spheri...
H01L 23/49575 :
Assemblies of semiconductor...
H01L 24/05 :
of an individual bonding area
H01L 24/16 :
of an individual bump conne...
H01L 24/32 :
of an individual layer conn...
H01L 24/45 :
of an individual wire conne...
H01L 24/48 :
of an individual wire conne...
H01L 24/73 :
Means for bonding being of ...
H01L 25/0657 :
Stacked arrangements of dev...
H01L 2924/00 :
Indexing scheme for arrange...
H01L 2924/0001 :
Technical content checked b...
H01L 2924/00012 :
Relevant to the scope of th...
H01L 2924/00014 :
the subject-matter covered ...
H01L 2924/01005 :
Boron [B]
H01L 2924/01006 :
Carbon [C]
H01L 2924/01007 :
Nitrogen [N]
H01L 2924/01012 :
Magnesium [Mg]
H01L 2924/01013 :
Aluminum [Al]
H01L 2924/01022 :
Titanium [Ti]
H01L 2924/01024 :
Chromium [Cr]
H01L 2924/01029 :
Copper [Cu]
H01L 2924/0103 :
Zinc [Zn]
H01L 2924/01033 :
Arsenic [As]
H01L 2924/01047 :
Silver [Ag]
H01L 2924/01049 :
Indium [In]
H01L 2924/0105 :
Tin [Sn]
H01L 2924/01051 :
Antimony [Sb]
H01L 2924/01073 :
Tantalum [Ta]
H01L 2924/01074 :
Tungsten [W]
H01L 2924/01078 :
Platinum [Pt]
H01L 2924/01079 :
Gold [Au]
H01L 2924/01082 :
Lead [Pb]
H01L 2924/01083 :
Bismuth [Bi]
H01L 2924/013 :
Alloys
H01L 2924/0132 :
Binary Alloys
H01L 2924/0133 :
Ternary Alloys
H01L 2924/0134 :
Quaternary Alloys
H01L 2924/014 :
Solder alloys
H01L 2924/04941 :
TiN
H01L 2924/04953 :
TaN
H01L 2924/09701 :
Low temperature co-fired ce...
H01L 2924/15151 :
the die mounting substrate ...
H01L 2924/15311 :
being a ball array, e.g. BGA
H01L 2924/15787 :
Ceramics, e.g. crystalline ...
H01L 2924/181 :
Encapsulation