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APPARATUS FOR USE IN THINNING A SEMICONDUCTOR WORKPIECE

  • US 20060220329A1
  • Filed: 06/12/2006
  • Published: 10/05/2006
  • Est. Priority Date: 08/20/2004
  • Status: Abandoned Application
First Claim
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1. A chuck for receiving and supporting a semiconductor workpiece with a device side and a back side, the chuck comprising:

  • a body for supporting the workpiece;

    a retainer removeably attached to the body and adapted to cover a peripheral portion of the back side of the workpiece; and

    a member forming a seal between the retainer and the back side of the workpiece, the member having an outer portion with a surface downwardly sloped towards the workpiece to create an angle at a point of contact between the member and the workpiece.

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