APPARATUS FOR USE IN THINNING A SEMICONDUCTOR WORKPIECE
First Claim
1. A chuck for receiving and supporting a semiconductor workpiece with a device side and a back side, the chuck comprising:
- a body for supporting the workpiece;
a retainer removeably attached to the body and adapted to cover a peripheral portion of the back side of the workpiece; and
a member forming a seal between the retainer and the back side of the workpiece, the member having an outer portion with a surface downwardly sloped towards the workpiece to create an angle at a point of contact between the member and the workpiece.
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Accused Products
Abstract
The present invention provides an apparatus and method for use in processing semiconductor workpieces. The new apparatus and method allows for the production of thinner workpieces that at the same time remain strong. Particularly, a chuck is provided that includes a body, a retainer removeably attached to the body and a seal forming member. When a workpiece is placed on the chuck body and the retainer is engaged to the body, a peripheral portion of the back side of the workpiece is covered by the retainer while an interior region of the back side of the workpiece is exposed. The exposed back side of the workpiece is then subjected to a wet chemical etching process to thin the workpiece and form a relatively thick rim comprised of semiconductor material at the periphery of the workpiece. The thick rim or hoop imparts strength to the otherwise fragile, thinned semiconductor workpiece. Semiconductor workpieces made according to the present invention offer an improved structure for handling thinned wafers in conventional automated equipment. This results in improved yields and improved process efficiency.
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Citations
50 Claims
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1. A chuck for receiving and supporting a semiconductor workpiece with a device side and a back side, the chuck comprising:
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a body for supporting the workpiece;
a retainer removeably attached to the body and adapted to cover a peripheral portion of the back side of the workpiece; and
a member forming a seal between the retainer and the back side of the workpiece, the member having an outer portion with a surface downwardly sloped towards the workpiece to create an angle at a point of contact between the member and the workpiece. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A chuck for receiving and supporting a semiconductor workpiece with a device side, a bevel and a back side, the chuck comprising:
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a body having a semiconductor workpiece support surface;
a retainer having an inner most portion removeably attached to the body and adapted to cover a peripheral portion of back side of the workpiece;
a first sealing member forming an inner most portion of the retainer, the first sealing member providing a seal between the retainer and the back side of the workpiece; and
a second sealing member providing a seal between the retainer and the body. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39)
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40. A chuck for supporting a workpiece having a device side, a bevel and a back side and preventing a process fluid from contacting the device side, bevel and a peripheral portion of the backside of the workpiece during a thinning process, the chuck comprising:
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a body having a recess and a surface for supporting the workpiece;
a retaining ring having;
an engagement member configured to cooperate with the recess in the body and removeably attach the retaining ring to the body such that the retaining ring covers the bevel and the peripheral portion of the back side of the workpiece; and
an annular cavity with a compressible member disposed therein for forming a seal between the retaining ring and the workpiece, the seal being unobstructed from the process fluid during the thinning process. - View Dependent Claims (41, 42, 43, 44, 45)
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46. An apparatus for use in supporting a semiconductor workpiece having a device side, a bevel and a back side during a process of thinning the workpiece, the apparatus comprising:
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a body having an outer periphery and an inner surface for supporting the workpiece;
a retaining ring having a first compressible member for forming a seal between the retainer and the back side of the workpiece;
means for removeably attaching the retaining ring to the body such that the retaining ring protects the bevel and a peripheral portion of the back side of the workpiece during the thinning process; and
a second compressible member for forming a seal between the retainer and the outer periphery of the body. - View Dependent Claims (47, 48, 49, 50)
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Specification