Precision printed circuit board based rogowski coil and method for manufacturing same

• US 20060220774A1
• Filed: 04/01/2005
• Published: 10/05/2006
• Est. Priority Date: 04/01/2005
• Status: Active Grant

• Current Assignee: Schweitzer Engineering Laboratories, Incorporated
• Original Assignee: Schweitzer Engineering Laboratories, Incorporated
• Inventors: Skendzic, Veselin
• Granted Patent: US 7,227,442 B2
• Time in Patent Office: Days
• US Class Current: 336/200
• CPC Class Codes: G01R 15/181 using coils without a magnetic core, e.g. Rogowski coils
• CPC Class Codes: H01F 5/003 Printed circuit coils

Abstract

A precision printed circuit board based Rogowski coil is formed including a printed circuit board including a first layer and second layer. The printed circuit board further defines an aperture for receiving an electrical path therethough. A first return path is defined about the aperture on the first layer of the printed circuit board, and a second return path—parallel to the first return path—is defined about the aperture on the second layer of the printed circuit board. A plurality of radial paths defined on the first layer of printed circuit board extend between the aperture and the first return path. A plurality of radial paths defined on the second layer of the printed circuit board extend between the aperture and the second return path. Each first layer radial path is connected with an adjacent second layer radial path to form a generally toroidally-shaped winding.

Claims

1. A device for sensing current in an electrical path, comprising:

a printed circuit board including a first layer and a second layer, the printed circuit board defining an aperture for receiving the electrical path therethrough,

a first return path defined about the aperture on the first layer of the printed circuit board,

a second return path defined about the aperture on the second layer of the printed circuit board, the second return path further being connected in parallel to the first return path,

a plurality of radial paths defined on the first layer of the printed circuit board, the first layer paths each extending between the aperture and the first return path, and

a plurality of radial paths defined on the second layer of the printed circuit board, the second layer radial paths each extending between the aperture and the second return path,

wherein each first layer radial path is connected with an adjacent second layer radial path to form a generally toroidally-shaped main coil winding.

2. The device of claim 1, further comprising a resistive network for external field cancellation electrically coupled to said first and second return paths and said main coil winding.

3. The device of claim 2, wherein said resistive network includes a resistor ratio adjustable to achieve external field cancellation.

4. The device of claim 3, said aperture having a center, said first and second return paths having a select radius from the center of said aperture, and wherein said first and second layer radial paths form an effective advancement path having a select radius from the center of said aperture, wherein the resistor ratio adjusted to achieve external field cancellation is in accordance with the following equation:

$R<br><br>\text{\hspace{1em}<br><br>}<br><br>1<br><br>\text{\hspace{1em}<br><br>}=\frac{\left(r_2^2-r_1^2\right)}{r_1^2}\times <br><br>R<br><br>\text{\hspace{1em}<br><br>}<br><br>2,$

wherein R1 and R2 are selected gain matching resistors, r₁ is the effective advancement path radius, and r₂ is the radius of the return paths.

5. The device of claim 1, wherein said first and second layer radial paths form an effective advancement path having a select radius from the center of said aperture.

6. The device of claim 1, said connection of first layer and second layer radial paths constituting a main coil advancing in a general direction, and said first and second return paths wrapped on top of said main coil in a reverse direction of advancement as said main coil winding.

7. The device of claim 1, further including a resistive network for temperature compensation electrically coupled to said first and second return paths and said main coil winding.

8. The device of claim 1, further including a resistive network for gain compensation electrically coupled to said first and second return paths and said main coil winding.

9. The device of claim 1, further including shielding material on top of said first and second layers of the printed circuit board.

10. The device of claim 1, further comprising a conductor connected to one of said radial paths, a conductor connected to said first return path, and a conductor connected to said second return path.

11. The device of claim 10, wherein each of said conductors are situated on a printed circuit board.

12. The device of claim 11, wherein said conductors are transposed to eliminate error.

13. The device of claim 10, further comprising a resistive network electrically coupled to said conductors for external field cancellation.

14. The device of claim 10, further comprising a resistive network electrically coupled to said conductors for temperature compensation.

15. The device of claim 10, further comprising a resistive network electrically coupled to said conductors for gain compensation.

16. The device of claim 10, wherein the second return path further being connected in parallel to the first return path through a plurality of vias between the first and second layers of the printed circuit board.

17. The device of claim 10, wherein each first layer radial path is connected to an adjacent second layer radial path through a via between the first and second layers of the printed circuit board.

18. The device of claim 1, wherein the electrical path is a conductor.

19. The device of claim 1, wherein the electrical path is a beam of ionized particles.

20. The device of claim 1, wherein the electrical path is an electrical transmission line.